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Hydrodynamic modeling of copper electrodeposition at a vertical rotating cylinder electrode

机译:垂直旋转圆柱电极上铜电沉积的流体动力学建模

摘要

The hydrodynamics of a rotating cylinder electrode were modeled to predict tertiary current distributions during electrodeposition of copper from acidic sulfate media, and to evaluate the effects of the resulting density gradients close to the electrode. Assuming no such density variations, then predictions of transport-limited current densities were in good agreement with Mizushina's empirical law and with Lévêque's theoretical description, but not with measured values. Assuming a linear density variation with copper concentration, predictions of concentration profiles agreed to within 3 % of experimentally measured limiting current densities at the rotating cylinder electrode. For solution compositions relevant to copper electrowinning, a diffusion coefficient for cupric ions of 1.2×10^-9 m2/s at 45 °C, was inferred by solving the continuity, Navier-Stokes and mass balance equations with Fluent® computational fluid dynamics software.
机译:对旋转圆柱电极的流体动力学建模,以预测从酸性硫酸盐介质电沉积铜期间的三次电流分布,并评估所产生的靠近电极的密度梯度的影响。假设没有这样的密度变化,那么对传输受限的电流密度的预测与瑞穗的经验定律和莱维克的理论描述完全吻合,但与测量值却并不吻合。假设密度随铜浓度线性变化,则浓度分布的预测值应在旋转圆柱电极上实验测量的极限电流密度的3%之内。对于与铜电解沉积有关的溶液成分,通过使用Fluent®计算流体动力学软件求解连续性,Navier-Stokes和质量平衡方程,得出45°C下铜离子的扩散系数为1.2×10 ^ -9 m2 / s 。

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