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On-chip interconnect boosting technique by using of 10-nm double gate-all-around (DGAA) transistor

机译:使用10nm双环全栅(DGAA)晶体管的片上互连增强技术

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摘要

Increasing short channel effects (SCEs) hinder further technology downscaling of CMOS transistors. Beyond the 10-nm technology node, the gate-all-around (GAA) FET is considered a promising solution for continuing Moore's law. In this study, we introduce a novel structure for speeding up the interconnect propagation using 10-nm channel length double gate-all around (DGAA) transistors. We propose a boosting structure that can significantly improve the performance of circuits by controlling the two gates of the DGAA independently. The proposed structure demonstrates that the propagation delay can be reduced by up to 30% for short interconnects and 47% for long interconnects. In high-speed, low-power IC designs, the proposed boosting structure gives circuit designers several options in the trade-off between power consumption and performance, which will play an important role in application-specific integration circuits in future GAA-based designs
机译:短沟道效应(SCE)的增加阻碍了CMOS晶体管技术的进一步缩小。除了10纳米技术节点之外,全方位栅极(GAA)FET被认为是继续遵守摩尔定律的有希望的解决方案。在这项研究中,我们介绍了一种新颖的结构,该结构可使用10 nm沟道长度双栅极全环绕(DGAA)晶体管加快互连的传播速度。我们提出了一种升压结构,该结构可以通过独立控制DGAA的两个栅极来显着改善电路性能。所提出的结构表明,对于短互连,传播延迟最多可以减少30%,对于长互连,则可以减少47%。在高速,低功耗IC设计中,拟议的升压结构为电路设计人员提供了功耗和性能之间折衷的几种选择,这将在未来基于GAA的设计中的专用集成电路中发挥重要作用

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