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Schottky Barrier Modulation of Metal/4H-SiC Junction with Thin Interface Spacer Driven by Surface Polarization Charge on 4H-SiC Substrate

机译:由4H-SiC衬底上的表面极化电荷驱动的具有薄界面间隔物的金属/ 4H-SiC结的肖特基势垒调制

摘要

The Au/Ni/Al2O3/4H-SiC junction with the Al2O3 film as a thin spacer layer was found to show the electrical characteristics of a typical rectifying Schottky contact, which is considered to be due to the leakiness of the spacer layer. The Schottky barrier of the junction was measured to be higher than an Au/Ni/4H-SiC junction with no spacer layer. It is believed that the negative surface bound charge originating from the spontaneous polarization of 4H-SiC causes the Schottky barrier increase. The use of a thin spacer layer can be an efficient experimental method to modulate Schottky barriers of metal/4H-SiC junctions.
机译:发现具有作为薄间隔层的Al 2 O 3膜的Au / Ni / Al 2 O 3/4 H-SiC结显示出典型的整流肖特基接触的电特性,这被认为是由于间隔层的泄漏引起的。测量结的肖特基势垒高于没有间隔层的Au / Ni / 4H-SiC结。认为源自4H-SiC的自发极化的负表面结合电荷引起肖特基势垒的增加。薄间隔层的使用可能是调制金属/ 4H-SiC结的肖特基势垒的有效实验方法。

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