首页> 外文OA文献 >Taking temperature in the area of welding of the structure thin components using induction heating

【2h】

Taking temperature in the area of welding of the structure thin components using induction heating

机译：使用感应加热在结构薄部件的焊接区域中获取温度

代理获取

本网站仅为用户提供外文OA文献查询和代理获取服务，本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文，但由于OA文献来源多样且变更频繁，仍可能出现获取不到、文献不完整或与标题不符等情况，如果获取不到我们将提供退款服务。请知悉。

页面导航

著录项
引文网络
相似文献
相关主题

著录项

作者
Пулька Чеслав Вікторович; Сенчишин Віктор Степанович; Гаврилюк Володимир Ярославович; Книшук С. І.; Pulka Ch. V.; Senchishin V. S.; Gavrilyuk V. Ya.; Knishuk S. I.;
展开▼
作者单位

展开▼
年度 2017
总页数
原文格式 PDF
正文语种 uk
中图分类

相似文献

外文文献
中文文献
专利

1. A comparison between induction pre-heating and induction post-heating of laser-induction hybrid welding on S690QL steel [J] . Li Li, Mi Gaoyang, Wang Chunming Journal of Manufacturing Processes . 2019,第Jula期

机译：S690QL钢上激光感应混合焊接的感应预热和感应后热比较
2. A comparison between induction pre-heating and induction post-heating of laser-induction hybrid welding on S690QL steel [J] . Li Li, Mi Gaoyang, Wang Chunming Journal of Manufacturing Processes . 2019,第JULa期

机译：S690QL钢上激光感应混合焊接的感应预热和感应后热比较
3. A process-structure-property model for welding of 9Cr power plant components: The influence of welding process temperatures on in-service cyclic plasticity response [J] . Mac Ardghail P., Harrison N., Leen S. B. International Journal of Pressure Vessels and Piping . 2019,第期

机译：9CR发电厂组件焊接过程 - 结构 - 结构性能模型：焊接过程温度对锻炼循环可塑性反应的影响
4. Preparation of Ultra-Thin Metallic Susceptor Structures for Electromagnetic Induction Heating of Reactive Polymer Interphases [C] . L. Ziegler, E. Kampert, A. Janke, Europe/Africa Regional Conference Dresden of the Polymer Processing Society . 2019

机译：用于电磁感应加热反应性聚合物的电磁感应的超薄金属敏感结构的制备
5. Hybrid Induction Heating and Linear Friction Welding [D] . Kelly, Matthew R. 2019

机译：混合感应加热和线性摩擦焊接
6. Effects of Heating Mode and Temperature on the Microstructures Electrical and Optical Properties of Molybdenum Thin Films [O] . Haili Zhao, Jingpei Xie, Aixia Mao, 2018

机译：加热方式和温度对钼薄膜微结构电学和光学性质的影响
7. The influence of heating temperature and sizes of components upon stresses and defect formation in semiconductor structures under isothermal heating [O] . O.A. Agueev 2001

机译：等温加热下半导体结构胁迫下加热温度和大小尺寸的影响

Taking temperature in the area of welding of the structure thin components using induction heating

著录项

引文网络

相似文献

相关主题

期刊订阅