Polyimides thanks to the unique properties such us thermal stability, good mechanical and electrical characteristic, resistance to high energy a wide temp erature range, excellent planarization popular in engineering and technology, particular in microelectronics. The production efficiency can be improved by providing photoresist properties to the polyimide materials using in microelectronics technology due to reduction of process steps and low bad production. Conversation is about, the creation of photosensitive pol-yimides negative and positive type containing reactive groups, which can by capable of being polymerized by UV-light with photo initiator. The main aim of this work increase the sensitivity, resolution and heat resistance of the material, on the base of a photosensitive polyimide composition. A new photosensitive polyimide composition based on polyamide acid solution in an organic solvent, tetramaleinamidoasid with the light-sensitive component. As show in the article, the possibility to create polymer cposs-linked structure which can explain solubility difference after UV-radiation exposure in the chemical natural of the compounds. The composition has shown good results in photosensitivity and other properties.
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