Process of electrochemical deposition of copper on a steel and iron substrate from citrate electrolytes was investigated. It is determined that the material of cathode greatly influences the kinetics of copper plating process. Influence of pulse electrolysis on a range of working density of current, a current efficiency of copper and porosity of coatings were investigated. It is determined that application of a pulse mode increases a range of working density of current and improves quality of the received coatings.
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