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Electroless deposited thin films prepared with activated SAM (self-assembled monolayer) for electronics devices

机译：用活化的SAM（自组装单层）制备的化学沉积薄膜，用于电子设备

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制度:新 ; 文部省報告番号:甲2330号 ; 学位の種類:博士(工学) ; 授与年月日:2007/3/15 ; 早大学位記番号:新4392

机译：系统：新；教育部报告号：Ko 2330；学位类型：博士（工程学）；授予日期：2007/3/15；早稻田大学注册处号：新4392

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吉野正洋;
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年度 2007
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1. Support-Free Transfer of Ultrasmooth Graphene Films Facilitated by Self-Assembled Monolayers for Electronic Devices and Patterns [J] . Wang Bin, Huang Ming, Tao Li, ACS nano . 2016,第1期

机译：电子器件和图案的自组装单层促进超光滑石墨烯薄膜的无支撑转移
2. NiSi contact metallization using electroless Ni deposition on Pd-activated self-assembled monolayer (SAM) on p-type Si(100) [J] . A. Duhin, Y. Sverdlov, I. Torchinsky, Microelectronic Engineering . 2007,第11期

机译：使用在p型Si（100）上的Pd激活自组装单层（SAM）上进行化学镀Ni沉积实现NiSi接触金属化
3. Self-assembled monolayers and chemical derivatization of Ba0.5Sr0.5TiO3 thin films: Applications in phase shifter devices [J] . Morales-Cruz AL, Van Keuls FW, Miranda FA, Applied Surface Science . 2005,第4期

机译：Ba0.5Sr0.5TiO3薄膜的自组装单层和化学衍生化：在移相器中的应用
4. Properties of BiFeO_3 Thin Films Prepared with Self-assembled Monolayers by Liquid Phase Deposition [C] . Jun Yin, Guoqiang Tan, Lihua Song, CICC-7;China international conference on high-performance ceramics . 2012

机译：液相沉积自组装单层BiFeO_3薄膜的性能
5. Self-assembled thin-films of gold nanoparticles for the fabrication of electronic devices [D] . Agarwal, Rajan 2004

机译：用于电子设备制造的金纳米粒子的自组装薄膜
6. Effects of self-assembled monolayer structural order surface homogeneity and surface energy on pentacene morphology and thin film transistor device performance [O] . Daniel Orrin Hutchins, Tobias Weidner, Joe Baio, -1

机译：并五苯形态和薄膜晶体管的器件性能的自组装单层结构顺序表面均匀性和表面能的影响
7. Electroless deposited thin films prepared with activated SAM (self-assembled monolayer) for electronics devices [O] . 吉野正洋 2007

机译：用于电子器件的活化sam（自组装单层）制备的无电沉积薄膜
8. Ionic Self-Assembled Monolayer (ISAM) Nonlinear Optical Thin Films and Devices [R] . Miller, M. B. 1998

机译：离子自组装单层（Isam）非线性光学薄膜和器件

Electroless deposited thin films prepared with activated SAM (self-assembled monolayer) for electronics devices

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