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Investigation of adhesion mechanism and pore-sealing layer between tantalum barrier layer and porous SiLK

机译：钽阻挡层与多孔SiLK之间的粘附机理和气密层研究

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HU YUE;
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年度 2006
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正文语种 en
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1. Porous low k film with multilayer structure used for promoting adhesion to SiCN cap barrier layer [J] . Zhou M., Zhang B. C. Microelectronics reliability . 2015,第6期

机译：具有多层结构的多孔低k膜，用于促进与SiCN盖阻挡层的粘附
2. Numerical and experimental investigation of DNAPL removal mechanisms in a layered porous medium by means of soil vapor extraction [J] . Hongkyu Yoon, Mart Oostrom, Thomas W. Wietsma, Journal of Contaminant Hydrology . 2009,第1a4期

机译：土壤蒸汽萃取对层状多孔介质中DNAPL去除机理的数值和实验研究
3. Investigation of the barrier properties of copper-vanadium alloys with a sub-tantalum layer on low-k dielectrics [J] . Park Jae-Hyung, Kim Kyoung-Deok, Jeon Hyeong-Tag, Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics . 2017,第期

机译：低钾电介质亚钽层铜 - 钒合金阻挡性能研究
4. Pore-sealing by etch-byproduct followed by ALD-Ta adhesion layer for Cu/porous low-k interconnects [C] . Furuya A., Soda E., Yoneda K., Interconnect Technology Conference, 2004. Proceedings of the IEEE 2004 International . 2004

机译：用于铜/多孔低k互连的蚀刻副产物和ALD-Ta粘合层的孔隙密封
5. Seedless electrochemical deposition of copper on air-exposed tantalum nitride barriers with ultra-thin adhesion layers. [D] . Lay, Nicole Elizabeth. 2006

机译：在具有超薄粘附层的空气暴露的氮化钽阻挡层上进行无核电化学沉积铜。
6. Surface Modification and Characterisation of Silk Fibroin Fabric Produced by the Layer-by-Layer Self-Assembly of Multilayer Alginate/Regenerated Silk Fibroin [O] . Gaotian Shen, Xingyou Hu, Guoping Guan, -1

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7. Interface and layer periodicity effects on the thermal conductivity of copper-based nanomultilayers with tungsten, tantalum, and tantalum nitride diffusion barriers [O] . Claudia Cancellieri, Ethan A. Scott, Jeffrey Braun, 2020

机译：对钨，钽和氮化钽扩散屏障的铜基纳米型纳米移层导热率的界面和层周期性效应

Investigation of adhesion mechanism and pore-sealing layer between tantalum barrier layer and porous SiLK

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