首页> 外文OA文献 >Investigation of adhesion mechanism and pore-sealing layer between tantalum barrier layer and porous SiLK

【2h】

Investigation of adhesion mechanism and pore-sealing layer between tantalum barrier layer and porous SiLK

机译：钽阻挡层与多孔SiLK之间的粘附机理和气密层研究

代理获取

本网站仅为用户提供外文OA文献查询和代理获取服务，本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文，但由于OA文献来源多样且变更频繁，仍可能出现获取不到、文献不完整或与标题不符等情况，如果获取不到我们将提供退款服务。请知悉。

页面导航

著录项
引文网络
相似文献
相关主题

著录项

作者
HU YUE;
展开▼
作者单位

展开▼
年度 2006
总页数
原文格式 PDF
正文语种 en
中图分类

相似文献

外文文献
中文文献
专利

1. Porous low k film with multilayer structure used for promoting adhesion to SiCN cap barrier layer [J] . Zhou M., Zhang B. C. Microelectronics reliability . 2015,第6期

机译：具有多层结构的多孔低k膜，用于促进与SiCN盖阻挡层的粘附
2. Numerical and experimental investigation of DNAPL removal mechanisms in a layered porous medium by means of soil vapor extraction [J] . Hongkyu Yoon, Mart Oostrom, Thomas W. Wietsma, Journal of Contaminant Hydrology . 2009,第1a4期

机译：土壤蒸汽萃取对层状多孔介质中DNAPL去除机理的数值和实验研究
3. Investigation of the barrier properties of copper-vanadium alloys with a sub-tantalum layer on low-k dielectrics [J] . Park Jae-Hyung, Kim Kyoung-Deok, Jeon Hyeong-Tag, Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics . 2017,第期

机译：低钾电介质亚钽层铜 - 钒合金阻挡性能研究
4. Pore-sealing by etch-byproduct followed by ALD-Ta adhesion layer for Cu/porous low-k interconnects [C] . Furuya A., Soda E., Yoneda K., Interconnect Technology Conference, 2004. Proceedings of the IEEE 2004 International . 2004

机译：用于铜/多孔低k互连的蚀刻副产物和ALD-Ta粘合层的孔隙密封
5. Seedless electrochemical deposition of copper on air-exposed tantalum nitride barriers with ultra-thin adhesion layers. [D] . Lay, Nicole Elizabeth. 2006

机译：在具有超薄粘附层的空气暴露的氮化钽阻挡层上进行无核电化学沉积铜。
6. Surface Modification and Characterisation of Silk Fibroin Fabric Produced by the Layer-by-Layer Self-Assembly of Multilayer Alginate/Regenerated Silk Fibroin [O] . Gaotian Shen, Xingyou Hu, Guoping Guan, -1

机译：多层藻酸盐/再生丝素蛋白逐层自组装产生的丝素蛋白织物的表面改性和表征
7. Interface and layer periodicity effects on the thermal conductivity of copper-based nanomultilayers with tungsten, tantalum, and tantalum nitride diffusion barriers [O] . Claudia Cancellieri, Ethan A. Scott, Jeffrey Braun, 2020

机译：对钨，钽和氮化钽扩散屏障的铜基纳米型纳米移层导热率的界面和层周期性效应

Investigation of adhesion mechanism and pore-sealing layer between tantalum barrier layer and porous SiLK

著录项

引文网络

相似文献

相关主题

期刊订阅