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A study of Stretched Solder Column Interconnects for Ultra-Fine Pitch Flip Clip Packages

机译：超细间距翻转夹封装的拉伸焊柱互连研究

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ZHAO BING;
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年度 2008
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2. 150-$mu{rm m}$ Pitch Cu/Low-${rm k}$ Flip Chip Packaging With Polymer Encapsulated Dicing Line (PEDL) and Cu Column Interconnects [J] . Yoon S. W., Thew S. M. L., Lim S. Y. L., IEEE Transactions on Advanced Packaging . 2008,第1期

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3. 150-μm Pitch Cu/Low-k Flip Chip Packaging With Polymer Encapsulated Dicing Line (PEDL) and Cu Column Interconnects [J] . Seung Wook Yoon, Thew S.M.L., Lim S.Y.L., IEEE Transactions on Advanced Packaging . 2008,第1期

机译：具有聚合物封装的划片线（PEDL）和铜柱互连的150μm节距Cu / Low-k倒装芯片封装
4. Fatigue life estimation of a stretched-solder-column ultra-fine-pitch wafer level package using the macro-micro modelling approach [C] . Chng A.C., Tay A.A.O., Lim K.M., Electronic Components and Technology Conference, 2004. Proceedings. 54th . 2004

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5. A systems approach to ultra-fine pitch flip chip interconnect packaging. [D] . Nagarkar, Kaustubh Ravindra. 2005

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6. Eco-Friendly Lead-Free Solder Paste Printing via Laser-Induced Forward Transfer for the Assembly of Ultra-Fine Pitch Electronic Components [O] . Marina Makrygianni, Filimon Zacharatos, Kostas Andritsos, 2021

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7. Special Articles: The Micro Soldering Technology of Super High Density Packaging. Soldering Technology of Fine Pitch Packages. [O] . Haruo MISHINA 1994

机译：特殊用品：超高密度包装的微焊接技术。精细间距包装的焊接技术。
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机译：利用au-pt-pd厚膜导体在低温共烧陶瓷（LTCC）基板上分析细间距，倒装芯片焊料互连的拉伸强度行为

A study of Stretched Solder Column Interconnects for Ultra-Fine Pitch Flip Clip Packages

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