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Positive Photoresist as a Sacrificial Layer for MEMS Micro-component Fabrication with SU-8 Polymer

机译：正光刻胶作为牺牲层，用于使用SU-8聚合物制造MEMS微组件

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LAU KIA HIAN;
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年度 2012
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正文语种 en
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1. Use of a photoresist sacrificial layer with SU-8 electroplating mould in MEMS fabrication [J] . Song IH., Ajmera PK. Journal of Micromechanics and Microengineering . 2003,第6期

机译：带有SU-8电镀模的光刻胶牺牲层在MEMS制造中的应用
2. Fabrication of a three-layer SU-8 mould with inverted T-shaped cavities based on a sacrificial photoresist layer technique [J] . Junshan Liu, Dong Zhang, Baoyong Sha, Biomedical Microdevices . 2014,第5期

机译：基于牺牲性光刻胶层技术的具有倒T形腔的三层SU-8模具的制造
3. MEMS transducers low-cost fabrication using SU-8 in a sacrificial layer-free process [J] . Ge Chang, Cretu Edmond Journal of Micromechanics and Microengineering . 2017,第4期

机译：MEMS在无牺牲层面工艺中使用SU-8换能器的低成本制造
4. MEMS switches fabrication using photoresist as a sacrificial layer [C] . Molinero David, Castaner Luis Spanish Conference on ELectron Devices . 2009

机译：MEMS使用光致抗蚀剂作为牺牲层来切换制造
5. Fabrication of Multi-Layered, Freestanding, SU-8 Structures Using a Buried Photoresist Mask Method [D] . Walker, Zachariah Alexander. 2018

机译：使用掩埋的光刻胶掩模方法制造多层，独立式，SU-8结构
6. Fabrication of Covalently Crosslinked and Amine-Reactive Microcapsules by Reactive Layer-by-Layer Assembly of Azlactone-Containing Polymer Multilayers on Sacrificial Microparticle Templates [O] . Eric M. Saurer, Ryan M. Flessner, Maren E. Buck, -1

机译：共价交联和胺活性的制作通过吖内酯 - 含反应层与层之间的微胶囊大会聚合物多层膜在牺牲微粒模板
7. Fabrication of Polymeric Multimode Waveguides and Devices in SU-8 Photoresist Using Selective Polymerization. [O] . Borreman A., Musa S., Kok A.A.M., 2002

机译：利用选择性聚合制备sU-8光刻胶中的聚合多模波导和器件。
8. UV Baked/Cured Photoresist Used as a Sacrificial Layer in MEMS Fabrication [R] . Takacs, T. P. , Pulskamp, J. , Polcawich, R. 2005

机译：UV焙烧/固化光刻胶用作mEms制造中的牺牲层

Positive Photoresist as a Sacrificial Layer for MEMS Micro-component Fabrication with SU-8 Polymer

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