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Thermal stress analysis of laminated plates using global-local higher-order model

机译:基于全局局部高阶模型的层合板热应力分析

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摘要

A global-local higher order model taking into account transverse normal deformation is presented for the analysis of laminated composite plates subjected to the actual temperature field. The in-plane temperature field is expressed as a harmonic series expansion whereas the nonlinear temperature profile across the thickness direction is determined by solving the heat conduction equation. The validity of the proposed model is verified by comparing results with existing publications. Moreover, influence of the temperature fields along the thickness direction on the thermal behaviors of laminates is also investigated. A merit of the present model is that transverse shear stresses can be evaluated directly from the constitutive equations without stress smoothing.
机译:提出了考虑横向法向变形的全局局部高阶模型,用于分析层压板在实际温度场下的变形。平面内温度场表示为谐波级数展开,而厚度方向上的非线性温度曲线则通过求解热传导方程来确定。通过将结果与现有出版物进行比较,验证了所提出模型的有效性。此外,还研究了沿厚度方向的温度场对层压板热性能的影响。本模型的一个优点是可以直接从本构方程评估横向剪应力,而无需进行应力平滑。

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