In this paper, the thermal-moisture analogy schemes were applied to simulate moisture diffusion in an epoxy resin and CFRP strengthened concrete system numerically. The two thermal-moisture analogy schemes were adopted for homogeneous material (e.g., epoxy adhesive) or multi-component material systems. The direct analogy (DA) is only valid for the homogeneous material system and can simulate the moisture diffusion in an epoxy adhesive accurately. The normalized analogy (NA) was proved be an effective tool for the CFRP-concrete system. In addition, based on NA, the interfacial stress and swelling stress induced by water can be simulated accurately
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