Adherent diamond coatings on cemented tungsten carbide substrates with new Fe/Ni/Co binder phase

摘要

WC–Co hard metals continue to gain importance for cutting, mining and chipless forming tools. Cobalt metal currently dominates the market as a binder because of its unique properties. However, the use of cobalt as a binder has several drawbacks related to its hexagonal close-packed structure and market price fluctuations. These issues pushed the development of pre-alloyed binder powders which contain less than 40 wt.% cobalt. In this paper we first report the results of extensive investigations of WC–Fe/Ni/Co hard metal sintering, surface pretreating and deposition of adherent diamond films by using an industrial hot filament chemical vapour deposition (HFCVD) reactor. In particular, CVD diamond was deposited onto WC–Fe/Ni/Co grades which exhibited the best mechanical properties. Prior to deposition, the substrates were submitted to surface roughening by Murakami's etching and to surface binder removal by aqua regia. The adhesion was evaluated by Rockwell indentation tests (20, 40, 60 and 100 kg) conducted with a Brale indenter and compared to the adhesion of diamond films grown onto Co-cemented tungsten carbide substrates, which were submitted to similar etching pretreatments and identical deposition conditions. The results showed that diamond films on medium-grained WC–6 wt.% Fe/Ni/Co substrates exhibited good adhesion levels, comparable to those obtained for HFCVD diamond on Co-cemented carbides with similar microstructure.