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Characterization and microhardness of electrodeposited Ni-W-P coatings obtained from gluconate bath

机译:从葡萄糖酸盐浴获得的电沉积Ni-W-P涂层的表征和显微硬度

摘要

Electrodeposited Ni-W-P alloy coatings are considered as one of the potential replacements for conventional hard chromium. In this work, Ni-W-P coatings with different phosphorous concentrations have been prepared by direct current (DC) and pulse current (PC) electrodeposition methods using gluconate bath for the first time. These coatings were characterized by XRD, FESEM, AFM, DSC and XPS techniques. Thicknesses and current efficiencies are found to be more in DC plated coatings compared to PC plated coatings. EDX analysis confirms the presence of nickel, tungsten and phosphorous in the deposits and amount of P is observed to be more in PC coatings compared to DC coatings. XRD studies demonstrate that the coatings are nanocrystalline in nature which on heat treatment show the formation of Ni3P phase. FESEM demonstrates that DC Ni-W-P alloy deposits show fine nodules, whereas all PC Ni-W-P coatings have fine grains with smooth morphology. Increase in roughness with time and increase in P content is observed in AFM roughness measurement. DSC of DC coatings are characterized by two peaks (250 and 360 oC) while pulse plated exhibits only the high temperature peak. Ni is in both +2 and metallic states in all coatings, whereas Wo and W6+ species are observed in all coatings. Amount of oxidized Ni is more in PC coatings in comparison with DC coatings. On the other hand, P is in Pd- and P5+ states in these coatings. PC coatings show higher microhardness and it increases with heat treatment.
机译:电沉积的Ni-W-P合金涂层被认为是传统硬铬的潜在替代品之一。在这项工作中,首次使用葡萄糖酸盐浴通过直流(DC)和脉冲电流(PC)电沉积方法制备了具有不同磷浓度的Ni-W-P涂层。这些涂层通过XRD,FESEM,AFM,DSC和XPS技术进行了表征。发现直流镀层的厚度和电流效率比PC镀层的厚度和电流效率更高。 EDX分析证实沉积物中存在镍,钨和磷,与DC涂层相比,PC涂层中的P含量更高。 XRD研究表明该涂层本质上是纳米晶体,其在热处理时显示出Ni3P相的形成。 FESEM表明,DC Ni-W-P合金沉积物显示出细小结节,而所有PC Ni-W-P镀层均具有细小且具有平滑形态的晶粒。在AFM粗糙度测量中观察到粗糙度随时间增加和P含量增加。 DC涂层的DSC具有两个峰值(250和360 oC),而脉冲镀膜仅表现出高温峰值。在所有涂层中,Ni均处于+2和金属态,而在所有涂层中均观察到Wo和W6 +物种。与DC涂层相比,PC涂层中的氧化Ni含量更高。另一方面,在这些涂层中,P处于Pd-和P5 +状态。 PC涂层显示出更高的显微硬度,并且随着热处理的增加而增加。

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