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Reduction in thermal conductivity of Bi-Te alloys through grain refinement method

机译:通过晶粒细化方法降低Bi-Te合金的导热系数

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摘要

Ternary alloys of thermoelectric materials Bi–Sb–Te and Bi–Se–Te of molecular formula, Bi0·5Sb1·5Te3 (p type) and Bi0·36Se0·064Te0·576 (n type), were prepared by mechanical alloying method. The preparation of materials by mechanical alloying method has effectively reduced the thermal conductivity by generating a large number of induced grain boundaries with required degree of disorder. The process of frequent milling was adapted for grain refinement. Substantial reduction in thermal conductivity was achieved due to nano-structuring of these alloys. Thermaludconductivity values were found to be very low at room temperature, 0·5W/mK and 0·8W/mK, respectively forudp and n type materials.
机译:通过机械合金化方法制备了分子式为Bi0·5Sb1·5Te3(p型)和Bi0·36Se0·064Te0·576(n型)的热电材料Bi-Sb-Te和Bi-Se-Te三元合金。通过机械合金化方法制备材料,通过产生大量具有所需无序度的诱发晶界,有效降低了热导率。频繁研磨的过程适用于晶粒细化。由于这些合金的纳米结构,热导率大大降低。发现 udp和n型材料在室温下的导热/非导电性值非常低,分别为0·5W / mK和0·8W / mK。

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