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Growth, characterization and interfacial reaction of magnetron sputtered Pt/CeO2 thin films on Si and Si3N4 substrates

机译:Si和Si3N4衬底上磁控溅射Pt / CeO2薄膜的生长,表征和界面反应

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摘要

Pt/CeO2 thin films were deposited on Si and Si3N4 substrates by magnetron sputtering at room temperature. Growth of the films on Si and Si3N4 were characterized by XRD, FESEM and AFM. Interaction of Pt/CeO2 films with Si in Si and Si3N4 substrates was extensively investigated by XPS. XRD studies show that films are oriented preferentially to (200) direction of CeO2. XPS results show that Pt is mainly present in +2 oxidation state in Pt/CeO2/Si film, whereas Pt4+ predominates in Pt/CeO2/Si3N4 film. Ce is present as both +4 and +3 oxidation states in Pt/CeO2 films deposited on both Si and Si3N4 substrates, but concentration of Ce3+ species is observed to be more in Pt/CeO2/Si film. Interfacial reaction between CeO2 and Siudsubstrate is controlled in presence of Pt. Pt/Ce concentration ratio decreases in Pt/CeO2/Si3N4 film upon successive sputtering, whereas this ratio decreases initially and then increases in Pt/CeO2/Si film. Pt is segregated at the interface in Pt/CeO2/Si film, whereas Pt is diffused outwards in Pt/CeO2/Si3N4 film as observed from depth profiling studies.
机译:在室温下通过磁控溅射将Pt / CeO2薄膜沉积在Si和Si3N4衬底上。用XRD,FESEM和AFM表征了Si和Si3N4上薄膜的生长。 XPS广泛研究了Pt / CeO2薄膜与Si和Si3N4衬底中Si的相互作用。 XRD研究表明,薄膜的取向优先于CeO2的(200)方向。 XPS结果表明,Pt / CeO2 / Si薄膜中Pt主要以+2氧化态存在,而Pt / CeO2 / Si3N4薄膜中Pt4 +主要存在。在同时沉积在Si和Si3N4衬底上的Pt / CeO2薄膜中,Ce以+4和+3氧化态同时存在,但是在Pt / CeO2 / Si薄膜中,Ce3 +的浓度更高。在Pt的存在下,可以控制CeO2和Si ud衬底之间的界面反应。连续溅射时,Pt / CeO2 / Si3N4膜中的Pt / Ce浓度比降低,而Pt / CeO2 / Si膜中的Pt / Ce浓度比先降低然后升高。根据深度剖析研究,Pt在Pt / CeO2 / Si膜的界面处偏析,而Pt在Pt / CeO2 / Si3N4膜中向外扩散。

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