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Present status of microstructured semiconductor neutron detectors

机译:微结构半导体中子探测器的现状

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摘要

Semiconductor diode detectors coated with neutron reactive materials have been investigated as neutron detectors for many decades, and are fashioned mostly as planar diodes coated with boron-10 ([superscript 10]B), lithium-6 fluoride ([superscript 6]LiF) or gadolinium (Gd). Although effective, these detectors are limited in efficiency (the case for boron and LiF coatings) or in the ability to distinguish background radiations from neutron-induced interactions (the case for Gd coatings). Over the past decade, a renewed effort has been made to improve diode designs to achieve up to a tenfold increase in neutron detection efficiency over the simple planar diode designs. These new semiconductor neutron detectors are fashioned with a matrix of microstructured patterns etched deeply into the substrate and, subsequently, backfilled with neutron reactive materials. Intrinsic thermal-neutron detection efficiencies exceeding 40% have been achieved with devices no thicker than 1 mm while operating on less than 5 volts.
机译:涂有中子反应性材料的半导体二极管探测器已作为中子探测器进行了数十年的研究,并且大多形成为涂有硼10([上标10] B),氟化锂6(上标6LiF)或硼的平面二极管。 lin(Gd)。尽管有效,但这些探测器的效率(硼和LiF涂层的情况)或区分背景辐射与中子诱发的相互作用(Gd涂层的情况)的能力受到限制。在过去的十年中,已经做出了新的努力来改进二极管设计,以使中子探测效率比简单的平面二极管设计提高十倍。这些新型的半导体中子探测器采用微结构化图案的矩阵制成,该矩阵被深深蚀刻到基底中,然后回填了中子反应性材料。使用厚度不超过1毫米且工作电压低于5伏的设备,已经实现了超过40%的固有热中子检测效率。

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