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Very high cycle fatigue of copper: Evolution, morphology and locations of surface slip markings

机译:铜的极高循环疲劳:表面滑移痕迹的演变,形态和位置

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摘要

The surfaces of commercially pure polycrystalline copper specimens subjected to interrupted 20 kHz fatigue tests in the very high cycle fatigue regime were investigated. The stress amplitude needed to form the early slip markings was found twice lower than the stress amplitude required to fracture which confirmed the results obtained by Stanzl-Tschegg et al. (2007). Three types of slip markings were classified according to their morphology and their location in the polycrystalline material. They are compared to slip markings observed during fatigue tests at frequencies lower than 100 Hz and numbers of cycles lower than 107. For 20 kHz fatigue tests, stress amplitudes ranging from 45 MPa to 65 MPa produce straight and long early persistent slip markings located along twin boundaries. Stress amplitudes lower than 45 MPa produce clusters of fine early persistent slip markings mainly located at triple junctions.
机译:研究了在极高循环疲劳条件下经受中断的20 kHz疲劳测试的商业纯多晶铜试样的表面。发现形成早期滑移痕迹所需的应力幅度比断裂所需的应力幅度低两倍,这证实了Stanzl-Tschegg等人获得的结果。 (2007)。根据滑痕的形态和在多晶材料中的位置,将其分为三种类型。将它们与在疲劳测试期间在低于100 Hz的频率和低于107的周期数下观察到的滑动标记进行了比较。对于20 kHz疲劳测试,应力幅值范围从45 MPa到65 MPa会在双胞胎上产生笔直而长的早期持久滑动标记边界。低于45 MPa的应力幅值会产生簇状的早期细微持续痕迹,主要位于三重交界处。

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