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Effects of abrasive tools on surface finishing under brittle-ductile grinding regimes when manufacturing glass

机译:制造玻璃时研磨工具对脆性-磨削状态下表面光洁度的影响

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摘要

This paper addresses the effects of bonds and grains of abrasive tools on the edge aspect of ground glasssurface. Diamond grains and silicon carbide (SiC) grains combined with two bond types, i.e., resin andmetal, were considered for this study. The surface edge characteristics were characterized using scanningelectron microscope (SEM) and interferometer observations. In particular, the spectrum of arithmeticmean was investigated for distinguishing the different scales of analysis. Experimental results showedthat the grinding forces vary sensitively with bond type and wheel velocity. Using diamond grains’ wheel,it was found that roughness level obtained with metallic bond is lower than that obtained with resin bond.However, using a resin-bonded wheel, two mechanisms of material removal were revealed according tograins’ type. (i) A partial ductile regime, i.e., ductile streaks and brittle fracture, obtained with diamondgrains, and (ii) a fully ductile regime obtained with SiC grains. Thus, it was found that ground surfaceobtained using SiC grains’ wheel has a better roughness than that obtained using diamond grains wheel.Besides, SiC grains seem to lead to more marked streaks and form defects.
机译:本文探讨了研磨工具的粘结和晶粒对磨玻璃表面边缘的影响。本研究考虑了金刚石和碳化硅(SiC)颗粒结合两种键类型,即树脂和金属。使用扫描电子显微镜(SEM)和干涉仪观察来表征表面边缘特性。尤其是,研究了算术范围,以区分不同的分析规模。实验结果表明,磨削力随粘结类型和砂轮速度的变化而敏感。使用金刚石晶粒的砂轮发现,金属键合的粗糙度要比使用树脂键合的粗糙度低。但是,使用树脂粘合的砂轮,根据晶粒的类型揭示了两种去除材料的机理。 (i)用金刚石晶粒获得的部分延性状态,即延性条纹和脆性断裂,和(ii)用SiC晶粒获得的完全延性状态。因此,发现使用SiC晶粒砂轮获得的磨削表面比使用金刚石晶粒砂轮获得的磨削表面更好。此外,SiC晶粒似乎会导致更明显的条纹并形成缺陷。

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