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Sticking probabilities of Cu, Zn, Sn, and S atoms in magnetron sputtering plasmas employing a Cu2ZnSnS4 stoichiometric target

机译:使用Cu2ZnSnS4化学计量靶的磁控溅射等离子体中Cu,Zn,Sn和S原子的粘附概率

摘要

Investigations on the density decays in the afterglow of pulsed magnetron sputtering plasmas employinga Cu2ZnSnS4 (CZTS) stoichiometric target were performed to evaluate the sticking probabilities of Cu, Zn,Sn and S atoms. The sticking probabilities were evaluated from the linear relationships between thedecay time constants of the atom densities and the discharge pressure. It has been found that the stickingprobabilities of Cu, Zn, and Sn are almost the same. On the other hand, the sticking probability of S atomwas found to be as low as 0.7 ± 0.1, if we assume unity for the sticking probabilities of Cu, Zn, and Sn.Therefore, it has been shown that the less-abundant composition of S atoms in sputter-deposited CZTSthin films is attributed to the small sticking probability of S.
机译:研究了使用Cu2ZnSnS4(CZTS)化学计量目标的脉冲磁控溅射等离子体的余辉密度衰减,以评估Cu,Zn,Sn和S原子的粘附概率。根据原子密度的衰减时间常数与排出压力之间的线性关系来评估粘着概率。已经发现,Cu,Zn和Sn的粘附概率几乎相同。另一方面,如果我们假设Cu,Zn和Sn的附着概率为1,则S原子的附着概率低至0.7±0.1,因此表明,S原子的附着量较少。溅射沉积的CZTS薄膜中的S原子归因于S的粘附可能性小。

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