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Influence of processing temperature and die angle on the grain microstructure produced by severe deformation of an Al-7 Si alloy

机译:加工温度和模具角对Al-7%Si合金严重变形产生的晶粒组织的影响

摘要

Severe plastic deformation by equal-channel angular pressing has been carried out to high strains by repeated pressing using both a high-strain die and a moderate-strain die at both room temperature and at intermediate temperature. The die used appears to play no role in determining the saturation grain and dislocation microstructure after very high strains, with similar submicron grains, high dislocation densities, and silicon particle refinement observed. A slight tendency to microstructural non-uniformity is seen with the high-strain die. Severe plastic deformation at intermediate temperature leads to a coarser grain size, lower dislocation density, and precipitation of silicon from solution. The extent of grain coarsening, dislocation recovery and precipitate growth is much greater than when annealing room-temperature deformed material, since the high dislocation density accelerates precipitate formation and growth. Material strength is well described by the respective contributions of grain boundaries, dislocations, and precipitates. © 2007 Elsevier B.V. All rights reserved.
机译:通过在室温和中间温度下均使用高应变模和中应变模反复进行压制,已经通过等通道角压进行了严重的塑性变形,从而产生了高应变。在非常高的应变后,所用的芯片似乎对确定饱和晶粒和位错的微观结构没有任何作用,观察到相似的亚微米晶粒,高位错密度和观察到的硅颗粒细化。在高应变模中,观察到微结构不均匀的轻微趋势。中间温度下的严重塑性变形会导致晶粒尺寸增大,位错密度降低以及溶液中硅的沉淀。晶粒粗化,位错恢复和析出物生长的程度比对室温变形材料进行退火时要大得多,因为高的位错密度会加速析出物的形成和生长。材料强度通过晶界,位错和析出物的各自贡献来很好地描述。 ©2007 Elsevier B.V.保留所有权利。

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