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Anodic Bonding Technique for Field Emission Display Spacer Mounting

机译:阳极键合技术,用于场发射显示器隔板安装

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摘要

[[abstract]]We studied the Anodic Bonding Technique in films which were made by different ways on glass substrate in this paper.. Then testing the strength degree of combining between Soda lime glass and Al/Cr/ITO films. We discussed the influences of different Al/Cr films to whole spacer strengths by changing thickness of film at interface , bonding temperature, bonding voltage in this paper. We measured the surface shape by AFM (atomic force microscope) . The bonding area were photo by optical microscopy, then analyzed by image software. The equipment EDS(Energy dispersive spectrometer) analyzed element in bonding interface. The strength of bonding were tested by stress and strain experiment. And SEM(scanning electron microscope) were used to observe the broken surface. The result from our experiment showed that the best bonding area, current, strength values were got in higher temperature, voltage, suitable thickness. That can be excellent spacers of Field emission display by collecting Wet Etching.The best parameters in our experiment were thickness 300nm, bonding temperature 300 ℃, bonding voltage 700V.
机译:[[摘要]]我们研究了在玻璃基板上以不同方式制作的薄膜中的阳极键合技术。然后测试了钠钙玻璃与Al / Cr / ITO薄膜之间结合的强度。通过改变界面处的膜厚,键合温度,键合电压,讨论了不同的Al / Cr膜对整体隔层强度的影响。我们通过AFM(原子力显微镜)测量了表面形状。通过光学显微镜对结合区域进行拍照,然后通过图像软件进行分析。设备EDS(能量色散光谱仪)分析了键合界面中的元素。结合强度通过应力和应变实验进行测试。并用SEM(扫描电子显微镜)观察断面。我们的实验结果表明,在较高的温度,电压和合适的厚度下,可以获得最佳的结合面积,电流,强度值。通过收集湿法刻蚀,可以成为场发射显示器的极好隔离物。本实验中的最佳参数是厚度300nm,键合温度300℃,键合电压700V。

著录项

  • 作者

    Yen W. T.;

  • 作者单位
  • 年度 2012
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  • 原文格式 PDF
  • 正文语种 en
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