Kinetic analysis of mica tape curing process

摘要

Curing program of thermoset insulating materials and its responsible setting has the key importance for assuranceof high quality and reliability of electrical devices. It is possible to determine parameters of this program (temperature andtime of curing) by several ways in practise. There is mostly focused on methods based on kinetic analysis. The resultcomparison of selected methods of kinetic analysis and residual enthalpy measurement is the main aim of the paper. Twoinsulating tapes were chosen for the purpose of this study. These tapes correspond in their composition (glass fabric, micaand epoxy binder), but they differ in curing agent type. Simultaneous thermal analysis (STA) was used during themeasurements. Monitored results demonstrate the advantages and disadvantages of particular methods.