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Characterization of Nanoscopic Cu/Diamond Interfaces Prepared by Surface-Activated Bonding: Implications for Thermal Management

机译：表面活性键合制备的纳米型Cu /金刚石界面的表征：热管理的意义

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Jianbo Liang; Yutaka Ohno; Yuichiro Yamashita; Yasuo Shimizu; Shinji Kanda; Naoto Kamiuchi; Seongwoo Kim; Koyama Koji; Yasuyoshi Nagai; Makoto Kasu; Naoteru Shigekawa;
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1. Characterization of Cu/Cu Bonding Interface Prepared by Surface Activated Bonding at Room Temperature [J] . Jun Utsumi, Yuko Yuko Ichiyanagi Journal of Basic and Applied Physics . 2014,第4期

机译：室温表面活化键合制备的Cu / Cu键合界面的表征
2. Selective interfacial bonding and thermal conductivity of diamond/Cu-alloy composites prepared by HPHT technique [J] . Hui Chen, Cheng-chang Jia, Xian Jia International Journal of Minerals,Metallurgy and Materials . 2012,第4期

机译：HPHT技术制备的金刚石/铜合金复合材料的选择性界面结合和导热性
3. Selective interfacial bonding and thermal conductivity of diamond/Cu-alloy composites prepared by HPHT technique [J] . Hui Chen, Cheng-chang Jia, Xian Jia International Journal of Minerals,Metallurgy and Materials . 2012,第4期

机译：用HPHT技术制备的金刚石/ Cu合金复合材料的选择性界面粘接和导热系数
4. Characterization of bonding interface prepared by room temperature bonding after flattening by thermal imprint process [C] . Kurashima Yuichi, Maeda Atsuhiko, Takagi Hideki Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS . 2013

机译：热压印工艺压平后室温粘合制备的粘合界面的表征
5. Surface and Interface Dynamics of Cu and Cu Alloys Driven by Thermal and Chemical Stimuli [D] . Zou, Lianfeng. 2017

机译：热和化学刺激驱动的Cu和Cu合金的表面和界面动力学
6. Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu [O] . Jing-Ye Juang, Chia-Ling Lu, Yu-Jin Li, 2018

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7. Interface characterization of Cu-Cu and Cu-Ag-Cu low temperature solid state bonds. [O] . Dalbey Robert Z., Challenger Kenneth D. 1987

机译：Cu-Cu和Cu-Ag-Cu低温固态键的界面表征。

Characterization of Nanoscopic Cu/Diamond Interfaces Prepared by Surface-Activated Bonding: Implications for Thermal Management

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