首页> 外文OA文献 >Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/0.1㎛-Ni thin ENEPIG solder joint

【2h】

Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/0.1㎛-Ni thin ENEPIG solder joint

机译：SN-3.0AG-0.5CU /0.1㎛-NI薄ENEPIG焊点的界面反应和机械强度

代理获取

本网站仅为用户提供外文OA文献查询和代理获取服务，本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文，但由于OA文献来源多样且变更频繁，仍可能出现获取不到、文献不完整或与标题不符等情况，如果获取不到我们将提供退款服务。请知悉。

页面导航

著录项
相似文献
相关主题

著录项

作者
Jong-Hoon Back; Sehoon Yoo; Deok-Gon Han; Seung-Boo Jung; Jeong-Won Yoon;
展开▼
作者单位

展开▼
年度 2017
总页数
原文格式 PDF
正文语种
中图分类
入库时间 2022-08-20 22:28:06

相似文献

外文文献
中文文献
专利

1. Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications [J] . Lee Byung-Suk, Ko Yong-Ho, Bang Jung-Hwan, Microelectronics & Reliability . 2017,第APRa期

机译：用于电力电子应用的Sn-3.0Ag-0.5Cu / Ni / Cu和Au-20Sn / Ni / Cu焊点的界面反应和机械强度
2. Effects of a phosphorous-containing Pd layer in a thin-ENEPIG surface finish on the interfacial reactions and mechanical strength of a Sn-58Bi solder joint [J] . Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics . 2020,第期

机译：含磷PD层在薄Enepig表面光洁度上的界面反应和Sn-58Bi焊点的机械强度的影响
3. Effects of Ni(P) layer thickness and Pd layer type in thin-Au/Pd/Ni(P) surface finishes on interfacial reactions and mechanical strength of Sn-58Bi solder joints during aging [J] . Jungsoo Kim, Seung-Boo Jung, Jeong-Won Yoon Journal of materials science . 2020,第22期

机译：Ni（P）层厚度和PD层型在薄-au / pd / ni（p）表面上的效果在老化期间对Sn-58bi焊点的界面反应和机械强度进行结束
4. Effect of Ni(P) thickness of ultrathin ENEPIG on the interfacial reaction and board level reliability of solder joints [C] . Yibo Wang, Hongfa Pan, Charles Nan-Cheng Chen, IEEE Electronic Components and Technology Conference . 2020

机译：超薄ENEPIG的Ni（P）厚度对焊点的界面反应和板级可靠性的影响
5. Reliability of solder joints in flip chip technology: Approaches from fundamental studies of wetting, interfacial reaction, mechanical shear testing, and electromigration. [D] . Liu, Cheng-Yi. 2000

机译：倒装芯片技术中焊点的可靠性：润湿，界面反应，机械剪切测试和电迁移等基础研究的方法。
6. Combined Thermodynamic-Kinetic Analysis of the Interfacial Reactions between Ni Metallization and Various Lead-Free Solders [O] . Tomi Laurila, Vesa Vuorinen 2009

机译：镍金属化与各种无铅焊料之间界面反应的热力学动力学综合分析
7. Interfacial reaction between Sn-3.0Ag-0.5Cu solder/Co-P plating and Ni-Co-P plating [O] . Daito Tomoya, Nishikawa Hiroshi, Takemoto Tadashi, 2013

机译：Sn-3.0Ag-0.5Cu焊料/ Co-P镀层与Ni-Co-P镀层之间的界面反应

Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/0.1㎛-Ni thin ENEPIG solder joint

著录项

相似文献

相关主题

期刊订阅