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Effect of Bonding Temperature on Microstructure Evolution during TLP Bonding of a Ni3Al based Superalloy IC10

机译：基于Ni3Al超合金IC10的TLP键合过程中粘合温度对微观结构演化的影响

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Xiong Yue; Fengmei Liu; Hexing Chen; Di Wan; Hongbo Qin;
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1. Effect of Bonding Temperature on Microstructure Evolution during TLP Bonding of a Ni ₃Al based Superalloy IC10 [J] . Xiong Yue, Fengmei Liu, Hexing Chen, MATEC Web of Conferences . 2018,第1期

机译：Ni _{3 Al基高温合金IC10在TLP键合过程中键合温度对组织演变的影响}
2. Effect of post-bond heat treatment on microstructure and mechanical properties of the wide gap TLP bonded IC10 superalloy with a low boron Ni_3Al-based interlayer [J] . Yue Xiong, Liu Fengmei, Li Qi, Journal of Manufacturing Processes . 2020,第Juna期

机译：粘合后热处理对低硼Ni_3Al interlayer的宽间隙TLP粘结IC10超合金组织和力学性能的影响
3. TLP bonding of cast IN718 nickel based superalloy: Process-microstructure-strength characteristics [J] . M. Pouranvari, A. Ekrami, A.H. Kokabi Materials Science and Engineering . 2013,第apra15期

机译：铸造IN718镍基高温合金的TLP粘结：工艺-组织-强度特性
4. INFLUENCE OF TLP BONDING ON CREEP DEFORMATION OF A NICKEL-BASE SINGLECRYSTAL SUPERALLOY AT HIGH TEMPERATURE [C] . LIU Jide, JIN Tao, ZHAO Nairen, International Symposium on Superalloys . 2008

机译：TLP键合对高温镍基单晶高温合金蠕变变形的影响
5. The effects of bonding parameters on isothermal solidification rate and microstructure of TLP bonded in 738LC superalloy. [D] . Idowu, Oluwaseun Ayodeji. 2005

机译：键合参数对738LC高温合金中TLP键合的等温凝固速率和组织的影响。
6. Microstructure Evolution and Mechanical Properties of Al-TiB2/TiC In Situ Aluminum-Based Composites during Accumulative Roll Bonding (ARB) Process [O] . Jinfeng Nie, Fang Wang, Yusheng Li, 2017

机译：Al-TiB2 / TiC原位铝基复合材料在累积辊压粘结（ARB）过程中的组织演变和力学性能
7. Effect of Bonding Temperature on Microstructure and Mechanical Properties during TLP Bonding of GH4169 Superalloy [O] . Qing He, Dongdong Zhu, Duo Dong, 2019

机译：GH4169超合金中TLP键合过程中粘合温度对微观结构和机械性能的影响
8. Evaluation of the Transient Liquid Phase (TLP) Bonding Process for Ti3Al-Based Honeycomb Core Sandwich Structure [R] . Bird, R. Keith, Hoffman, Eric K. 1998

机译：Ti3al基蜂窝芯夹层结构瞬态液相（TLp）键合工艺评价

Effect of Bonding Temperature on Microstructure Evolution during TLP Bonding of a Ni3Al based Superalloy IC10

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