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Microstructure and mechanical properties of lead-free Sn-Cu-Ni composite solder paste reinforced with silicon (Si) particles

机译：用硅（Si）颗粒加固无铅Sn-Cu-Ni复合焊膏的微观结构和力学性能

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R. M. Said; M. A. A. Mohd Salleh; M. I. I. Ramli; N. Saud; M. M. Al Bakri Abdullah; A. V. Sandu;
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年度 2017
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1. Effects of diamond nanoparticles reinforcement into lead-free Sn-3.0Ag-0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process [J] . Srivalli Chellvarajoo, M.Z. Abdullah, C.Y. Khor Materials & design . 2015,第OCTa5期

机译：金刚石纳米颗粒增强无铅Sn-3.0Ag-0.5Cu焊膏对回流焊后的组织和力学性能的影响
2. An Investigation of TiO2 Addition on Microstructure Evolution of Sn-Cu-Ni Solder Paste Composite [J] . Norainiza Saud*, Rita Mohd Said, Mohd Arif Anuar Mohd Salleh, MATEC Web of Conferences . 2016,第1期

机译：TiO2添加对Sn-Cu-Ni锡膏复合材料组织演变的影响
3. Microstructure and mechanical properties of Lead-free Sn-Cu solder composites prepared by rapid directional solidification [J] . Jun Shen, Yongchang Liu, Yajing Han, Journal of materials science . 2007,第12期

机译：快速定向凝固制备无铅锡铜焊料复合材料的组织和力学性能
4. Microstructure and Mechanical Properties of Lead-free Sn-Cu-Ni Composite Solder Paste Reinforced with Silicon (Si) Particles [C] . R M Said, M A A Mohd Salleh, M I I Ramli, International Conference on Advanced Material Engineering and Technology . 2017

机译：用硅（Si）颗粒加固无铅Sn-Cu-Ni复合焊膏的微观结构和力学性能
5. Characterization of Several Lead-Free Nanosolder Particles and Their Preparation for Nanocomposite Solder Pastes [D] . ?Kepner, Robert 2020

机译：纳米复合焊膏的几种无铅纳米玻璃器颗粒的表征及其制备
6. Soldering of Passive Components Using Sn Nanoparticle Reinforced Solder Paste: Influence on Microstructure and Joint Strength [O] . Anas M. Atieh, Tala J. Abedalaziz, Abdulaziz AlHazaa, 2019

机译：使用Sn纳米粒子增强焊膏焊接无源部件：对微观结构和关节强度的影响
7. Effect of Particle Size on Microstructure and Mechanical Properties of Al-Based Composite Reinforced with 10 Vol.% Mechanically Alloyed Mg-7.4%Al Particles [O] . Anil K. Chaubey, Prashanth Konda Gokuldoss, Zhi Wang, 2016

机译：粒径对10％机械合金化mg-7.4％al颗粒增强al基复合材料组织和力学性能的影响

Microstructure and mechanical properties of lead-free Sn-Cu-Ni composite solder paste reinforced with silicon (Si) particles

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