We develop a new Voronoi protocol, which is a space tessellation method, togenerate fully dense (containing no voids) nanocrystalline models of copper(Cu) with precise grain size control; we also perform uniaxial tensile testsusing molecular dynamical (MD) simulations to measure the elastic moduli of thegrain boundary and the grain interior components at 300 K. We find that thegrain boundary deforms more locally compared with the grain core region underthermal vibrations and is elastically less stiff than the core component atfinite temperature. The elastic modulus of the grain boundary is lower than 30%of that of the grain interior. Our results will aid in the development of moreaccurate continuum models of nanocrystalline metals.
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