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Effect of Substrate Bipolar Pulse Voltage on the Properties of Cu Films on the Paper Substrate Using Magnetron Sputtering with Multipolar Magnetic Plasma Confinement Assisted by Inductively Coupled Plasma

机译：磁控溅射与电感耦合等离子体辅助磁控溅射对纸基板上Cu膜性能的影响。电感耦合等离子体辅助

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Fumiya MORISHIGE; Kazuki OTANI; Muneo HIRANO; Keishi KAWABATA; Keishi OKAMOTO;
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年度 2011
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Effect of Substrate Bipolar Pulse Voltage on the Properties of Cu Films on the Paper Substrate Using Magnetron Sputtering with Multipolar Magnetic Plasma Confinement Assisted by Inductively Coupled Plasma

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