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Study on the Material Removal Function of Ultrasonic-assisted Abrasive Flow Polishing Sapphire

机译：超声波辅助磨料抛光蓝宝石材料去除功能研究

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Qiming Qian; Cui Wang; Qiang Liu; Yuqiang Li;
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1. Abrasive removal depth for polishing a sapphire wafer by a cross-patterned polishing pad with different abrasive particle sizes [J] . Zone-Ching Lin, Ren-Yuan Wang The International Journal of Advanced Manufacturing Technology . 2014,第1a4期

机译：通过具有不同磨料粒径的十字图案抛光垫抛光蓝宝石晶片的磨料去除深度
2. Investigation of Abrasive Removal Depth of Sapphire Wafer for Different Slurry Volume Concentrations of Chemical Mechanical Polishing with Cross Pattern Polishing Pad [J] . Lin Zone-Ching, Wang Ren-Yuan Journal of the Chinese Society of Mechanical Engineers, Series C: Transactions of the Chinese Society of Mechanical Engineers . 2015,第2期

机译：十字图案抛光垫化学机械抛光不同浆料浓度下蓝宝石晶片的磨料去除深度研究
3. A research on ultrasonic-assisted abrasive waterjet polishing of hard-brittle materials [J] . Lv Zhe, Huang Chuanzhen, Zhu Hongtao, The International Journal of Advanced Manufacturing Technology . 2015,第5a8期

机译：脆性材料的超声辅助磨料水射流抛光研究
4. Influence of Polishing and Pressing Force on the Material Removal Rate in Fixed Abrasive Polishing with Compact Robot [C] . Masaki Niwa, Sachiko Ogawa, Toshiki Hirogaki, ISAAT 2012 . 2012

机译：紧凑型机器人抛光和压力对固定磨料抛光材料去除率的影响
5. Study of fixed abrasive polishing and characterization of diamondlike carbon film as a low-k material. [D] . Venigalla, Rajasekhar. 2001

机译：固定磨料抛光的研究以及作为低k材料的类金刚石碳膜的表征。
6. Study on Material Removal Model by Reciprocating Magnetorheological Polishing [O] . Rensheng Wang, Shichao Xiu, Cong Sun, 2021

机译：往复式磁流变抛光材料去除模型研究
7. Hydration-assisted Ultrasonic Abrasive Flow Polishing Technology on Sapphire Microcavity [O] . Xiao-bing LIU, Lin MA 2019

机译：蓝宝石微腔水合辅助超声波磨料流动抛光技术

Study on the Material Removal Function of Ultrasonic-assisted Abrasive Flow Polishing Sapphire

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