首页> 外文OA文献 >Study on bonding of heat-resisting fine ceramics. (Raport 5). Effect of the copper enriched layer on relaxation of thermal stress.

【2h】

Study on bonding of heat-resisting fine ceramics. (Raport 5). Effect of the copper enriched layer on relaxation of thermal stress.

机译：耐热陶瓷粘接研究。（拼图5）。富含铜富含层对热应力弛豫的影响。

代理获取

本网站仅为用户提供外文OA文献查询和代理获取服务，本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文，但由于OA文献来源多样且变更频繁，仍可能出现获取不到、文献不完整或与标题不符等情况，如果获取不到我们将提供退款服务。请知悉。

页面导航

著录项
引文网络
相似文献
相关主题

著录项

作者
Yoshikuni Nakao; Kazutoshi Nishimoto; Kazuyoshi Saida; Hisashi Nakamura; Kanji Katada;
展开▼
作者单位

展开▼
年度 1989
总页数
原文格式 PDF
正文语种
中图分类

相似文献

外文文献
中文文献
专利

1. Relaxation of Thermal Stress in Direct Bonding by Partitioning the Bonding Area for Fabrication of Optical Isolator with Semiconductor Guiding Layer [J] . Kazumasa Sakurai, Kenji Abe, Tetsuya Mizumoto Japanese journal of applied physics . 2009,第11期

机译：通过划分键合区域以制造带有半导体导光层的光隔离器，可以缓解直接键合中的热应力
2. Study on thermal stability and irradiation response of copper/iron nano-multilayer composite fabricated by cross accumulative roll bonding [J] . Zhang L. F., Gao R., Hou J., Journal of Nuclear Materials: Materials Aspects of Fission and Fusion . 2021,第1期

机译：交叉累积辊粘合铜/铁纳米多层复合材料的热稳定性和照射响应研究
3. A Heat-Resisting Acid Catalyst: Thermal Stability and Acidity of a Thin Silica Layer on Alumina Calcined at 1493 K [J] . Naonobu Katada, Hideaki Ishiguro, Koh-ichi Muto, Chemical vapor deposition: CVD . 1995,第2期

机译：耐热酸催化剂：在1493 K煅烧的氧化铝上的二氧化硅薄层的热稳定性和酸性
4. Fine pitch copper wire bonding on copper bond pad process optimization [C] . Kan Wai Lam, Hong Meng Ho, Serguei Stoukatch, International Symposium on Electronic Materials and Packaging . 2002

机译：细间距铜线键合在铜键焊盘工艺优化上
5. Plastic Anisotropy and Kink Band Formation in Fine Grained Copper-Niobium Multilayers Produced by Accumulative Roll Bonding [D] . Nizolek, Thomas Joseph. 2016

机译：通过累积辊粘合产生的细粒铜铌多层的塑料各向异性和扭结带形成
6. Shear Bonding Strength and Thermal Cycling Effect of Fluoride Releasable/Rechargeable Orthodontic Adhesive Resins Containing LiAl-F Layered Double Hydroxide (LDH) Filler [O] . Chih-Ying Hung, Jian-Hong Yu, Liang-Wei Su, 2019

机译：含LiAl-F层状双氢氧化物（LDH）填料的氟可释放/可充电正畸粘合树脂的剪切粘结强度和热循环效应
7. Relationship between Joint Strength and Bonded Area of Numerical Analysis for Diffusion Bonding of Ultra Fine Machined Copper. Study on Diffusion Bonding of Copper. Report 2. [O] . Yasuhiro FUKAYA, Akihiko IKUTA, Kouhei IWANISHI, 2002

机译：超精细机加工铜扩散粘合数值分析的关节强度和粘结面积的关系。铜扩散粘合研究。报告2。
8. Study of Copper on Graphite with Titanium or Chromium Bond Layer [R] . Abel, Phillip B., Korenyi-Both, Andras L., Honecy, Frank S., 1994

机译：钛或铬键合层石墨上铜的研究

Study on bonding of heat-resisting fine ceramics. (Raport 5). Effect of the copper enriched layer on relaxation of thermal stress.

著录项

引文网络

相似文献

相关主题

期刊订阅