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Newly developed micro-parallel seam joining equipment and its applications. Micro-parallel seam joining and development of joining equipment. (4th Report).

机译：新开发的微平行接缝连接设备及其应用。电连接设备的微平行缝连接和开发。（第4次报告）。

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Susumu Aono; Kouichi Ohmori; Masaki Furuya; Toshiaki Takakura;
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年度 1989
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7. Micro-parallel seam joining and development of joining equipment. (3rd Report). Influence of bath constituent on microstructure and joining characteristics of plating layer at the joining interface. [O] . Susumu Aono, Kouichi Ohmori, Atsushi Ito 1988

机译：电连接设备的微平行缝连接和开发。（第三次报告）。浴组分对连接界面在电镀层的微观结构和连接特性的影响。
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Newly developed micro-parallel seam joining equipment and its applications. Micro-parallel seam joining and development of joining equipment. (4th Report).

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