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Micro-parallel seam joining and development of joining equipment. (3rd Report). Influence of bath constituent on microstructure and joining characteristics of plating layer at the joining interface.

机译：电连接设备的微平行缝连接和开发。（第三次报告）。浴组分对连接界面在电镀层的微观结构和连接特性的影响。

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Susumu Aono; Kouichi Ohmori; Atsushi Ito;
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年度 1988
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Micro-parallel seam joining and development of joining equipment. (3rd Report). Influence of bath constituent on microstructure and joining characteristics of plating layer at the joining interface.

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