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On the measurement of second principal stress by the copper electroplating method. Circumferential stress at the bottom of circular groove by bending.

机译：铜电镀法测量第二主应力。通过弯曲圆形凹槽底部的圆周应力。

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Seiichiro KITAOKA; Yasuo NAGASE;
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年度 1990
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4. Sensitivity of a stress measurement method for copper electroplating using the effects of stress concentration [C] . S.J. Kwon, T. Kinji, K. Ogawa, 11th International Conference on Computational Methods and Experimental Measurements (CMEM 2003) 2003 Halkidiki, Greece . 2003

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8. Aging, stressing and solderability of electroplated and electroless copper [R] . Sorensen, N. R. , Hosking, F. M. 1995

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On the measurement of second principal stress by the copper electroplating method. Circumferential stress at the bottom of circular groove by bending.

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