首页> 外文OA文献 >The Interface Microstructure and Shear Strength of Sn2.5Ag0.7Cu0.1RExNi/Cu Solder Joints under Thermal-Cycle Loading

【2h】

The Interface Microstructure and Shear Strength of Sn2.5Ag0.7Cu0.1RExNi/Cu Solder Joints under Thermal-Cycle Loading

机译：SN2.5AG0.7CU0.1REXNI / Cu焊点在热循环负载下的界面微观结构和剪切强度

代理获取

本网站仅为用户提供外文OA文献查询和代理获取服务，本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文，但由于OA文献来源多样且变更频繁，仍可能出现获取不到、文献不完整或与标题不符等情况，如果获取不到我们将提供退款服务。请知悉。

页面导航

著录项
引文网络
相似文献
相关主题

著录项

作者
Congcong Cao; Keke Zhang; Baojin Shi; Huigai Wang; Di Zhao; Mengmeng Sun; Chao Zhang;
展开▼
作者单位

展开▼
年度 2019
总页数
原文格式 PDF
正文语种
中图分类

相似文献

外文文献
中文文献
专利

1. Improving the shear strength of Sn-Ag-Cu-Ni/Cu-Zn solder joints via modifying the microstructure and phase stability of Cu-Sn intermetallic compounds [J] . Wei-Yu Chen, Chi-Yang Yu, Jenq-Gong Duh Intermetallics . 2014,第Null期

机译：通过改变Cu-Sn金属间化合物的微观结构和相稳定性来提高Sn-Ag-Cu-Ni / Cu-Zn焊点的剪切强度
2. Shear strength and interfacial microstructure of Sn-Ag-xNi/Cu single shear lap solder joints [J] . Yang-Hsien Lee, Hwa-Teng Lee Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing . 2007,第1a2期

机译：Sn-Ag-xNi / Cu单剪切搭接焊点的剪切强度和界面微观结构
3. Elevated Temperature Aging of Solder Joints Based on Sn-Ag-Cu:Effects on Joint Microstructure and Shear Strength [J] . I.E.Anderson, J.L.Harringa Journal of Electronic Materials . 2004,第12期

机译：基于Sn-Ag-Cu的焊点高温时效：对焊点微观结构和剪切强度的影响
4. The effects of Cu nanoparticles addition in Sn-3.0Ag-0.5Cu solder paste on the microstructure and shear strength of the solder joints [C] . Ping Liu, Xiaolong Gu, Haifeng Fu, International Conference on Electronic Packaging Technology . 2016

机译：Sn-3.0Ag-0.5Cu锡膏中添加Cu纳米粒子对焊点组织和剪切强度的影响
5. Effect of processing parameters and thermal cycling on the microstructure and strength of eutectic tin-silver solder on Cu. [D] . Chada, Srinivas. 1998

机译：工艺参数和热循环对共晶锡银焊料在Cu上的组织和强度的影响。
6. Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu [O] . Jing-Ye Juang, Chia-Ling Lu, Yu-Jin Li, 2018

机译：（111）定向和纳米孪晶铜的结合界面微观结构与铜-铜接头的剪切强度之间的相关性
7. Effect of 0.05 wt. Pr Addition on Microstructure and Shear Strength of Sn-0.3Ag-0.7Cu/Cu Solder Joint during the Thermal Aging Process [O] . Jie Wu, Songbai Xue, Jingwen Wang, 2019

机译：0.05重量％的效果。％Pr添加到热老化过程中Sn-0.3Ag-0.7Cu / Cu / Cu / Cu焊接接头的微观结构和剪切强度
8. Effect of interface microstructure on the mechanical properties of Pb-free hybrid microcircuit solder joints [R] . Hernandez, C. L., Vianco, P. T., Rejent, J. A. 1998

机译：界面微结构对无铅杂化微电路焊点力学性能的影响

The Interface Microstructure and Shear Strength of Sn2.5Ag0.7Cu0.1RExNi/Cu Solder Joints under Thermal-Cycle Loading

著录项

引文网络

相似文献

相关主题

期刊订阅