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Effects of Zn-Bearing Flux on Joint Reliability and Microstructure of Sn-3.5Ag Soldering on Electroless Ni-Au Surface Finish

机译：锌轴承通量对无电镀镍焊接焊接的关节可靠性和微观结构的影响

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Hitoshi Sakurai; Youichi Kukimoto; Seongjun Kim; Alongheng Baated; Kiju Lee; Keun-Soo Kim; Seishi Kumamoto; Katsuaki Suganuma;
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1. Effects of Zn-Bearing Flux on Joint Reliability and Microstructure of Sn-3.5Ag Soldering on Electroless Ni-Au Surface Finish [J] . Hitoshi Sakurai, Youichi Kukimoto, Seongjun Kim, Materials transactions . 2010,第10期

机译：含锌助焊剂对化学镀Ni-Au表面处理Sn-3.5Ag焊点的接头可靠性和微观结构的影响
2. Effects of Cu contents in flux on microstructure and joint strength of Sn-3.5Ag soldering with electroless Ni-P/Au surface finish [J] . Hitoshi Sakurai, Keun-Soo Kim, Kiju Lee, Microelectronics & Reliability . 2012,第11期

机译：助焊剂中的铜含量对化学镀Ni-P / Au表面处理Sn-3.5Ag焊接组织和接头强度的影响
3. Joint Strength and Microstructure for Sn-Ag-(Cu) Soldering on an Electroless Ni-Au Surface Finish by Using a Flux Containing a Cu Compound [J] . SEISHI KUMAMOTO, HITOSHI SAKURAI, YOUICHI KUKIMOTO, Journal of Electronic Materials . 2008,第6期

机译：使用含Cu化合物的助焊剂在化学镀Ni-Au表面进行Sn-Ag-（Cu）焊接的接头强度和显微组织
4. The Effects of Surface Finish Roughness on Intermetallic Layer Growth, Intermetallic Interface Roughness, and Solder Joint Reliability [C] . Rodekohr C. L., Bozack M. J., Flowers G. T., Proceedings of the 56th IEEE Holm Conference on Electrical Contacts . 2010

机译：表面粗糙度对金属间层生长，金属间界面粗糙度和焊点可靠性的影响
5. Effect of cooling rate, silver composition, dwell time and solder joint size on the reliability of tin-silver-copper solder joints. [D] . Abtew, Mulugeta. 2010

机译：冷却速度，银成分，停留时间和焊点尺寸对锡-银-铜焊点可靠性的影响。
6. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components [O] . Mohd Nizam Ab. Rahman, Noor Suhana Mohd Zubir, Raden Achmad Chairdino Leuveano, 2014

机译：锡膏合金的可靠性研究以改善表面安装细间距元件的焊点
7. Erratum to: Effects of Forming Processes on the Microstructure and Solderability of Sn-3.5Ag Eutectic Solder Ribbons as well as the Mechanical Properties of Solder Joints [O] . Shengfa Liu, Zhebing Hu, Jieran Xiong, 2017

机译：误坏：形成过程对Sn-3.5Ag共晶焊丝器的微观结构和可耐可燃性的影响以及焊点的机械性能

Effects of Zn-Bearing Flux on Joint Reliability and Microstructure of Sn-3.5Ag Soldering on Electroless Ni-Au Surface Finish

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