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Analytical Gate Delay Variation Model with Temperature Effects in Near-Threshold Region Based on Log-Skew-Normal Distribution

机译:基于逻辑偏斜正态分布的近阈值区域温度效应的分析门延迟变化模型

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摘要

The near-threshold design is widely employed in the energy-efficient circuits, but it suffers from a high sensitivity to process variation, which leads to 2X delay variation due to temperature effects. Hence, it is not negligible. In this paper, we propose an analytical model for gate delay variation considering temperature effects in the near-threshold region. The delay variation model is constructed based on the log-skew-normal distribution by moment matching. Moreover, to deal with complex gates, a multi-variate threshold voltage approximation approach of stacked transistors is proposed. Also, three delay metrics (delay variability, ± 3 σ percentile points) are quantified and have a comparison with other known works. Experimental results show that the maximum of delay variability is 5% compared with Monte Carlo simulation and improves 5X in stacked gates compared with lognormal distribution. Additionally, it is worth mentioning that, the proposed model exhibits excellent advantages on − 3 σ and stacked gates, which improves 5X−10X in accuracy compared with other works.
机译:近阈值设计广泛用于节能电路,但它遭受了对处理变化的高灵敏度,这导致由于温度效应引起的2倍延迟变化。因此,它并不可忽略不计。在本文中,我们提出了考虑近阈值区域中的温度效应的栅极延迟变化的分析模型。延迟变化模型基于矩匹配基于Log-Skew-Normal分布来构造。此外,为了处理复杂的栅极,提出了一种堆叠晶体管的多变化阈值电压逼近方法。此外,量化了三个延迟度量(延迟变化,±3σ百分点),并与其他已知作品进行比较。实验结果表明,与蒙特卡罗模拟相比,延迟变异性最大为5%,与逻辑正式分布相比,堆叠栅极的5倍。此外,值得一提的是,所提出的模型在3Σ和堆叠门上表现出优异的优势,与其他作品相比,精确地提高了5倍-10x。

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