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Effect of Temperature on the Chip Soldering Process with AuGa0.03 Alloy Solder

机译：温度对Auga0.03合金焊料芯片焊接工艺的影响

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Zhihuan Zhao; Guanghao Gong; Mingming Jiang; Chuanzhong Chen; Yingyue Pan; Weili Liu; Li Zhang;
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1. Modeling the Interdependence of Processing and Alloy Composition on the Evolution of Microstructure in Sn-Based Lead-Free Solders in Fine Pitch Flip Chip [J] . Zhiheng Huang, Paul P. Conway, Changqing Liu, IEEE Transactions on Components and Packaging Technologies . 2006,第1期

机译：细间距倒装芯片中锡基无铅焊料的微观结构演变过程与合金成分的相互依赖性建模
2. Novel Mid-Temperature Alloy for Enabling Solder Processing Temperature Hierarchy in SMT Assembly [J] . SATHISH KUMAR, NICHOLAS HERRICK, RANJIT PANDHER, Global SMT & Packaging: European Edition (Surface Mount Technology) . 2018,第9期

机译：新型中温合金，用于使SMT组件中的焊料加工温度层次结构
3. Low-temperature low-cost 58 Bismuth-42 Tin alloy forensic chip re-balling and re-soldering [J] . Heckmann Th., Souvignet Th., Lepeer S., Digital investigation . 2016,第DECa期

机译：低温低成本58铋42锡合金取证芯片的重新焊球和重新焊接
4. PROPERTIES OF MIXING SAC SOLDER ALLOYS WITH BISMUTH-CONTAINING SOLDER ALLOYS FOR A LOW REFLOW TEMPERATURE PROCESS [C] . Tayler J. Swanson, Martin K. Anselm SMTA International Conference . 2020

机译：用含铋焊料合金混合囊焊料合金的性能，用于低回流温度工艺
5. A Study on Process, Strength and Microstructure Analysis of Low Temperature SnBi-Containing Solder Pastes Mixed with Lead-free Solder Balls [D] . Kannammal Palaniappan, Sakthi Cibi. 2016

机译：低温SNBI焊膏的工艺，强度和微观结构分析混合无铅焊球
6. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components [O] . Mohd Nizam Ab. Rahman, Noor Suhana Mohd Zubir, Raden Achmad Chairdino Leuveano, 2014

机译：锡膏合金的可靠性研究以改善表面安装细间距元件的焊点
7. Inprocess control of micro soldering process. (1st report). Temperature measurement at joint interface in micro-soldering process. [O] . Shuji Nakata, Tooru Nishikawa, Shigeru Saito 1989

机译：经过微型焊接过程的矿床。（第一个报告）。微焊接过程中的关节界面温度测量。
8. Wettability of low temperature solder alloys for step-soldering. [R] . Hosking, F. M., Vianco, P. T., Frear, D. R. 1991

机译：用于阶梯焊接的低温焊料合金的润湿性。

Effect of Temperature on the Chip Soldering Process with AuGa0.03 Alloy Solder

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