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Nanoindentation-Induced Pile-Up in the Residual Impression of Crystalline Cu with Different Grain Size

机译：不同晶粒尺寸的结晶Cu残余印象中的纳米indentation诱导的堆积

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Jiangjiang Hu; Weiming Sun; Taihua Zhang; Yusheng Zhang;
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1. A Predictive Framework for Dislocation-Density Pile-Ups in Crystalline Systems With Coincident Site Lattice and Random Grain Boundaries [J] . David M. Bond, Mohammed A. Zikry Journal of engineering materials and technology . 2017,第2期

机译：具有重合点格和随机晶界的晶体系统中位错-密度堆积的预测框架
2. Non-destructive optical analysis of band gap profile, crystalline phase, and grain size for Cu(In,Ga)Se_2 solar cells deposited by 1 -stage, 2-stage, and 3-stage co-evaporation [J] . Vikash Ranjan, Thomas Begou, Scott Little Progress in photovoltaics . 2014,第1期

机译：一阶段，两阶段和三阶段共蒸发沉积的Cu（In，Ga）Se_2太阳能电池的带隙轮廓，晶相和晶粒尺寸的无损光学分析
3. The effect of size, morphology and crystallinity of seed crystals on the nucleation and growth of Y-Ba-Cu-O single-grain superconductors [J] . E Sudhakar Reddy, N Hari Babu, K Iida Superconductor Science & Technology . 2005,第1期

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4. On the Influence of the Misorientation of Grains, Grain Size and Boundary Volume on the Strength and Ductility of Ultrafine Grained Cu [C] . Florian H. Dalla Torre, Rimma Lapovok, Peter F. Thomson, Nanoscale Materials and Modeling-Relations Among Processing, Microstructure and Mechanical Properties . 2004

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5. ACOUSTIC MEASUREMENTS OF RESIDUAL STRESSES AND GRAIN SIZES IN ALUMINUM ALLOYS (N.D.E., THICKNESS MEASUREMENT, ACOUSTOELASTICITY). [D] . FISHER, MARTIN JOHN. 1986

机译：铝合金中残余应力和晶粒尺寸的声学测量（N.D.E.，厚度测量，声弹性）。
6. Grain Refinement and Mechanical Properties of Cu–Cr–Zr Alloys with Different Nano-Sized TiCp Addition [O] . Dongdong Zhang, Fang Bai, Yong Wang, 2017

机译：不同纳米TiCp添加量的Cu-Cr-Zr合金的晶粒细化和力学性能
7. Nanoindentation-Induced Pile-Up in the Residual Impression of Crystalline Cu with Different Grain Size [O] . Jiangjiang Hu, Yusheng Zhang, Weiming Sun, 2017

机译：纳米压痕诱导不同晶粒结晶态Cu残余应力的堆积
8. Effect of microwave-enhanced superconductivity in YBa2Cu3O7 Bi-crystalline grain bounda ry weak-links [R] . Fu, C. M., Chen, C. M., Lin, H. C., 1995

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Nanoindentation-Induced Pile-Up in the Residual Impression of Crystalline Cu with Different Grain Size

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