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2-Mercaptobenzimidazole, 2-Mercaptobenzothiazole, and Thioglycolic Acid in an Electroless Nickel-Plating Bath

机译:2-巯基苯齐咪唑,2-巯基苯噻唑和化学镀镍浴中的巯基乙酸

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摘要

The use of three different materials, 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, and thioglycolic acid, was investigated to improve the performance of electroless nickel-plating baths. By changing the concentrations of these materials, sample plates were coated. Optical microscope images were obtained by selecting representative coated plates. From the results of the investigations, the effects of these materials on electroless nickel plating were observed, and the most appropriate amounts of these materials for nickel plating were determined. Moreover, the nickel plating speed observed with the bath solution containing 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, and thioglycolic acid is higher than that in the case of traditional electroless plating baths, but the nickel consumption amount in the former case is lower. In order to minimize the waste water generated from electroless nickel-plating baths, we determined the lowest amounts of the chemicals that can be used for the concentrations reported in the literature.
机译:研究了使用三种不同的材料,2-巯基苯齐咪唑,2-巯基苯噻唑和硫代醇酸,以提高化学镀镍浴的性能。通过改变这些材料的浓度,涂布样品板。通过选择代表性涂层的板获得光学显微镜图像。从研究结果中,观察到这些材料对化学镀镍的影响,测定了最合适的这些用于镀镍材料。此外,用含有2-巯基苯咪唑,2-巯基噻唑和巯基乙酸的浴溶液观察到镀镍速度高于传统化学镀浴的情况下,但以前壳体中的镍消费量较低。为了最小化由化学镀镍浴产生的废水,我们确定了可用于文献中报道的浓度的最低量的化学物质。

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