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Generation of Electromotive Force of Solder Wires and Solder Joints Caused by Their Deformation and Its Evaluation

机译：由其变形和评估引起的焊点和焊接接头的电动势的产生

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Tetsuo KUMAZAWA; Noboru NAKAYAMA; Nobutaka ITO; Kenichiro TSUBONE; Mitsunori ABE;
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年度 2006
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1. Gold wire and solder joint microforce testing using microforce tester [J] . Y. C. Chao, D. S. Liu Experimental Techniques . 2003,第5期

机译：使用微力测试仪测试金线和焊点的微力
2. Evaluation of Thin Copper Wire and Lead-Free Solder Joint Strength by Pullout Tests and Wire Surface Observation [J] . Naoya Tada, Takuhiro Tanaka, Takeshi Uemori, Crystals . 2017,第8期

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3. Evaluation of reliability and metallurgical integrity of wire bonds and lead free solder joints on flexible printed circuit board sample modules [J] . Daniel T. Rooney, Louis Gullo, Dongji Xie, Microelectronics reliability . 2007,第12期

机译：评估柔性印刷电路板样品模块上的引线键合和无铅焊点的可靠性和冶金学完整性
4. Deformation Evaluation of Solder Ball Joints by Electromotive Force [C] . T. Kumazawa, K. Kaminishi International Conference on Advances in Experimental Mechanics . 2008

机译：电动力焊球接头变形评价
5. Effect of cooling rate, silver composition, dwell time and solder joint size on the reliability of tin-silver-copper solder joints. [D] . Abtew, Mulugeta. 2010

机译：冷却速度，银成分，停留时间和焊点尺寸对锡-银-铜焊点可靠性的影响。
6. Soldering of Passive Components Using Sn Nanoparticle Reinforced Solder Paste: Influence on Microstructure and Joint Strength [O] . Anas M. Atieh, Tala J. Abedalaziz, Abdulaziz AlHazaa, 2019

机译：使用Sn纳米粒子增强焊膏焊接无源部件：对微观结构和关节强度的影响
7. Deformation Evaluation of Solder Ball Joints by Electromotive Force [O] . T. Kumazawa, K. Kaminishi 2008

机译：电动力焊球接头变形评价

Generation of Electromotive Force of Solder Wires and Solder Joints Caused by Their Deformation and Its Evaluation

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