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Self-Healing, Stretchable, Biocompatible, and Conductive Alginate Hydrogels through Dynamic Covalent Bonds for Implantable Electronics

机译：通过动态共价键的植入电子产品，通过动态共价键自愈，可伸缩，生物相容性和导电藻酸盐水凝胶

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Yeonsun Choi; Kyuha Park; Heewon Choi; Donghee Son; Mikyung Shin;
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年度 2021
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1. A self-healing, stretchable, and conductive Poly(N-vinylpyrrolidone)/gallic acid composite hydrogel formed via hydrogen bonding for wearable electronic sensors [J] . Zhao Mengchan, Tang Zuwu, Zhang Xiaohui, Composites Science and Technology . 2020,第Sepa29期

机译：通过氢键合用于可穿戴电子传感器的自愈合，可拉伸和导电聚（N-乙烯基吡咯烷酮）/神经酸复合水凝胶
2. Stretchable, Injectable, and Self-Healing Conductive Hydrogel Enabled by Multiple Hydrogen Bonding toward Wearable Electronics [J] . Chen Jingsi, Peng Qiongyao, Thundat Thomas, Chemistry of Materials: A Publication of the American Chemistry Society . 2019,第12期

机译：通过多种氢键朝向可穿戴电子器件的伸展，可注射和自愈的传导水凝胶。
3. Aminoglycoside hydrogels based on dynamic covalent bonds with pH sensitivity, biocompatibility, self-healing, and antibacterial ability [J] . Li Ya, Cheng Cui, Gao Xiaoran, Journal of Applied Polymer Science . 2020,第41a42期

机译：基于动态共价键的氨基糖苷水凝胶，具有pH敏感性，生物相容性，自愈和抗菌能力
4. Multifunctional Conductive Self-Healing Hydrogels with Pressure Sensitivity, Stretchability, and 3D Printability [C] . Malcolm Xine, Mohammad Darabi Society for Biomaterials annual meeting and exposition . 2019

机译：具有压力敏感性，可拉伸性和3D可印刷性的多功能导电自修复水凝胶
5. Characterization of hydrogel overlayers to improve implant biocompatibility. [D] . Norton, Lori Waynette. 2006

机译：水凝胶覆盖层的特性可改善植入物的生物相容性。
6. Highly Stretchable and Self-Healing Strain Sensors Based on Nanocellulose-Supported Graphene Dispersed in Electro-Conductive Hydrogels [O] . Chunxiao Zheng, Yiying Yue, Lu Gan, 2019

机译：基于分散在导电水凝胶中的纳米纤维素支撑的石墨烯的高度可拉伸和自修复应变传感器
7. Stretchable conductive nanocomposite based on alginate hydrogel and silver nanowires for wearable electronics [O] . Chanhyuk Lim, Yoonsoo Shin, Jaebong Jung, 2019

机译：基于藻酸盐水凝胶和可穿戴电子纳米线的可拉伸导电纳米复合材料

Self-Healing, Stretchable, Biocompatible, and Conductive Alginate Hydrogels through Dynamic Covalent Bonds for Implantable Electronics

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