首页> 外文OA文献 >Effects of short immersion time and cooling rates of copperizing process to the evolution of microstructures and copper behavior in the dead mild steel

【2h】

Effects of short immersion time and cooling rates of copperizing process to the evolution of microstructures and copper behavior in the dead mild steel

机译：铜化过程短浸泡时间和冷却速率对死钢微观结构和铜行为的演化

代理获取

本网站仅为用户提供外文OA文献查询和代理获取服务，本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文，但由于OA文献来源多样且变更频繁，仍可能出现获取不到、文献不完整或与标题不符等情况，如果获取不到我们将提供退款服务。请知悉。

页面导航

著录项
引文网络
相似文献
相关主题

著录项

作者
Wikan Jatimurti; Aprida Ulya Cunika;
展开▼
作者单位

展开▼
年度 2017
总页数
原文格式 PDF
正文语种
中图分类

相似文献

外文文献
中文文献
专利

1. Investigating the effects of short time austenitizing and cooling rate on pearlitic microstructure and mechanical properties of a hot rolled plain eutectoid carbon steel [J] . H. Rastegari, A. Kermanpur, A. Najafizadeh Materials & design . 2015,第feba期

机译：研究短时奥氏体化和冷却速率对热轧普通共析碳素钢珠光体组织和力学性能的影响
2. Effect of Reflow Time on Wetting Behavior, Microstructure Evolution, and Joint Strength of Sn-2.5Ag-0.5Cu Solder on Bare and Nickel-Coated Copper Substrates [J] . Sona Mrunali, Prabhu K. Narayan Journal of Electronic Materials . 2016,第7期

机译：回流时间对裸露和镀镍铜基板上Sn-2.5Ag-0.5Cu焊料的润湿行为，显微组织演变和接头强度的影响
3. Microstructure and kinetic analysis of the properties and behavior of nickel (Ni) nano-particle doped tin-zinc-bismuth (Sn-8Zn-3Bi) solders on immersion silver (Ag)-plated copper (Cu) substrates [J] . Tama Fouzder, Qingqian Li, Y. C. Chan, Journal of materials science . 2014,第6期

机译：浸银（Ag）镀铜（Cu）衬底上的镍（Ni）纳米颗粒掺杂锡-锌-铋（Sn-8Zn-3Bi）焊料的性能和行为的微观结构和动力学分析
4. Research on Temperature Change and Microstructure Evolution of Bore in Steel Target Penetrated by Copper Jets [C] . Hao Chen, Gang Tao Nanomaterials by severe plastic deformation . 2011

机译：铜射流侵彻钢靶内孔的温度变化和组织演变的研究
5. Effect of copper concentration and cooling rate on microstructure of tin-3.9silver-(X)copper. [D] . Athavale, Saurabh. 2006

机译：铜浓度和冷却速度对锡3.9银-（X）铜显微组织的影响。
6. Biocorrosion of mild steel and copper used in cooling tower water and its control [O] . Xiao Lei Li, Jayaraman Narenkumar, Aruliah Rajasekar, 2018

机译：冷却塔水软钢和铜的生物腐蚀及其控制
7. Investigation of the Microstructure of Mn-doped Tin-Silver-Copper Solder Alloys Solidified with Different Cooling Rates [O] . Tamas Hurtony, Oliver Krammer, Balazs Illes, 2019

机译：用不同冷却率固化的Mn掺杂锡 - 银铜焊料合金微观结构研究

Effects of short immersion time and cooling rates of copperizing process to the evolution of microstructures and copper behavior in the dead mild steel

著录项

引文网络

相似文献

相关主题

期刊订阅