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Improved film density for coatings at grazing angle of incidence in high power impulse magnetron sputtering with positive pulse

机译：采用正脉冲的高功率脉冲磁控溅射的放牧涂层涂层涂层的涂层薄膜密度

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F. Avino; D. Fonnesu; T. Koettig; M. Bonura; C. Senatore; A.T. Perez Fontenla; A. Sublet; M. Taborelli;
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1. Improved film density for coatings at grazing angle of incidence in high power impulse magnetron sputtering with positive pulse [J] . Avino F., Fonnesu D., Koettig T., Thin Solid Films . 2020,第Jul31期

机译：采用正脉冲的高功率脉冲磁控溅射的放牧涂层涂层涂层的涂层薄膜密度
2. Effect of Cu addition on the microstructure and properties of TiB2 films deposited by a hybrid system combining high power impulse magnetron sputtering and pulsed dc magnetron sputtering [J] . Ding Ji Cheng, Zhang Teng Fei, Yun Je Moon, Surface & Coatings Technology . 2018,第期

机译：Cu的作用对由高功率脉冲磁控溅射和脉冲DC磁控溅射组合的混合系统沉积的TIB2膜微观结构和性能
3. Deposition of yttria-stabilized zirconia thin films by high power impulse magnetron sputtering and pulsed magnetron sputtering [J] . Steffen S?nderby, AsimAijaz, Ulf Helmersson, Surface & Coatings Technology . 2014,第Null期

机译：高功率脉冲磁控溅射和脉冲磁控溅射沉积氧化钇稳定的氧化锆薄膜
4. Coating Properties of Cu and TiO_2 on Polymer Web Deposited by High Power Impulse Magnetron Sputtering With Positive Voltage Reversal (HIPIMS+VR) and Pulsed DC [C] . Mike Simmons, Frank Papa, Ivan Fernandez Society of Vacuum Coaters annual technical conference . 2019

机译：高功率反向磁控溅射（HIPIMS + VR）和脉冲直流在聚合物网上沉积Cu和TiO_2的涂层性能
5. Electrical and optical properties of silver films deposited by high power impulse magnetron sputtering. [D] . Li, Jigang. 2008

机译：通过大功率脉冲磁控溅射沉积的银膜的电学和光学性质。
6. Oblique angle deposition of nickel thin films by high-power impulse magnetron sputtering [O] . Hamidreza Hajihoseini, Movaffaq Kateb, Snorri Þorgeir Ingvarsson, 2019

机译：大功率脉冲磁控溅射镍薄膜的斜角沉积
7. Deposition of yttria-stabilized zirconia thin films by high power impulse magnetron sputtering and pulsed magnetron sputtering [O] . Sønderby, Steffen, Aijaz, Asim, Helmersson, Ulf, 2014

机译：大功率脉冲磁控溅射和脉冲磁控溅射沉积钇稳定的氧化锆薄膜

Improved film density for coatings at grazing angle of incidence in high power impulse magnetron sputtering with positive pulse

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