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Formation of Integrated Circuit Interconnection Using Copper Electroplating.

机译：使用铜电镀形成集成电路互连。

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Yuichi TAKADA; Kimiko OYAMADA; Shuhei MIURA; Hideo HONMA;
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年度 2001
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1. Effects of the high-pressure annealing process on the reflow phenomenon of copper interconnections for large scale integrated circuits [J] . Takashi Onishi, Hideo Fujii, Tetsuya Yoshikawa, Thin Solid Films . 2003,第1a2期

机译：高压退火工艺对大规模集成电路铜互连回流现象的影响
2. Integrated detectors for embedded optical interconnections on electrical boards, modules, and integrated circuits [J] . Sang-Yeon Cho, Sang-Woo Seo, Brooke M.A., IEEE journal of selected topics in quantum electronics . 2002,第6期

机译：集成探测器，用于在电路板，模块和集成电路上的嵌入式光学互连
3. Integrated detectors for embedded optical interconnections on electrical boards, modules, and integrated circuits [J] . Sang-Yeon Cho, Sang-Woo Seo, Brooke M.A., IEEE journal of selected topics in quantum electronics . 2002,第6期

机译：集成探测器，用于在电路板，模块和集成电路上的嵌入式光学互连
4. Process induced damages from various integrated circuit interconnection designs - limitations of antenna rule under practical integrated circuit layout practice [C] . Jerome Mercier, Thuy Dao, Henri Flechner, International Symposium on Plasma Process-Induced Damage . 2003

机译：各种集成电路互连设计的过程诱导损坏 - 实用集成电路布局实践下天线规则的限制
5. Materials, processes, and characterization of extended air-gaps for the intra-level interconnection of integrated circuits [D] . Park, Seongho 2008

机译：用于集成电路内部互连的扩展气隙的材料，工艺和特性
6. From the Cover: Materials and noncoplanar mesh designs for integrated circuits with linear elastic responses to extreme mechanical deformations [O] . Dae-Hyeong Kim, Jizhou Song, Won Mook Choi, 2008

机译：从封面开始：用于集成电路的材料和非共面网格设计具有对极端机械变形的线性弹性响应
7. New Technologies for Scaled-down Cu Interconnection in Ultra-Large Scale Integrated Circuits. Prospects on Copper Plating Systems for Ultra-large Scale Integrated Circuits. [O] . Hidemi NAWAFUNE 1998

机译：超大型集成电路中缩小CU互连的新技术。超大型集成电路镀铜系统的前景。
8. Rupture testing for the quality control of electrodeposited copper interconnections in high-speed, high-density circuits [R] . Zakraysek, Louis 1987

机译：用于高速，高密度电路中电沉积铜互连质量控制的断裂测试

Formation of Integrated Circuit Interconnection Using Copper Electroplating.

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