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Effects of Minute Amounts of Mg and Al Additives on the Wettability of Sn-8Zn-1Bi Pb-free Cream Solder

机译：微量镁和Al添加剂对SN-8ZN-1BI PB无铅膏焊料润湿性的影响

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Tomohisa Wataya; Masaaki Yoshikawa; Takashi Tanaka; Hiromitsu Kojima;
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4. Effects of Bi and Ni Addition on Wettability and Melting Point of Sn-0.3Ag-0.7Cu Low-Ag Pb-free Solder [C] . Jin Chen, Xiao-hua Luo Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008) . 2008

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Effects of Minute Amounts of Mg and Al Additives on the Wettability of Sn-8Zn-1Bi Pb-free Cream Solder

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