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Dedicated fixture design for polishing of silicon

机译:专用夹具设计,用于抛光硅

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摘要

Polishing of silicon is a major process seen in microelectronic and optical industries. As mirror-like surface finish is an essential factor that influences the performance of electronic and optical products, it has been believed that the fixture in finite element does play a role to produce such a quality surface on silicon. This paper centers on designing the fixture in finite element environment for polishing of silicon. Polishing process was virtually developed using general purpose FE codes. Process model consist of major components needed for polishing such as the base plate, the pad, the abrasive, silicon and of course of fixture. Currently only 2D model was considered because of the complexity of the process and limitation of the FE code. Fixed diamond abrasive proposed by VTT microelectronics was created in FE model to overcome the modeling difficulty of loose abrasives, to conveniently define polishing forces involved, and also investigated the effectiveness of the new abrasive design. Polishing forces were split into two-normal and tangential forces. The presence of micron-size diamond abrasive was modeled by defining friction coefficient at the interface between silicon and abrasive sheet. Typical values of polishing forces were defined as recommended by manufacturer. Finer mesh was designed at the top layer of the silicon in order to simulate the action of the diamond abrasive realistically. Polishing process was simulated by changing the various fixture designs. The goodness of the fixture design was justified by absence of high stress concentration in anywhere in the silicon.
机译:硅抛光是微电子和光学行业中的主要工艺。由于像镜子一样的表面光洁度是影响电子和光学产品性能的重要因素,因此人们认为,有限元的固定装置确实可以在硅上产生如此优质的表面。本文的重点是在有限元环境下设计用于抛光硅的夹具。抛光工艺实际上是使用通用FE代码开发的。工艺模型包括抛光所需的主要部件,例如基板,垫板,磨料,硅以及固定装置。由于过程的复杂性和FE代码的局限性,目前仅考虑2D模型。在有限元模型中创建了由VTT微电子公司提出的固定金刚石磨料,以克服疏松磨料的建模困难,方便地定义所涉及的抛光力,并且还研究了新磨料设计的有效性。抛光力分为法向力和切向力。通过定义硅和磨料片之间界面的摩擦系数,可以模拟微米级金刚石磨料的存在。抛光力的典型值是按照制造商的建议定义的。在硅的顶层设计了更细的网格,以便真实地模拟金刚石磨料的作用。通过更改各种夹具设计来模拟抛光过程。夹具设计的优良性是由于硅中任何地方都没有高应力集中而证明的。

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    Taufif Zakaria;

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  • 年度 2008
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