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The Recycling of Printed Wiring Board Scraps Using a Shape Sorting Technique. Recovering Copper Components by the Inclined Vibrating Method.

机译：使用形状分选技术回收印刷线路板废料。通过倾斜的振动方法回收铜组分。

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Shigeki KOYANAKA; Shigehisa ENDOH; Hiroyuki IWATA;
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年度 1995
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3. Electroless Copper Deposition in a Blind Via Hole of Printed Wiring Board. Uniform Copper Deposition by Axial Temperature Gradient [J] . Toshifumi Matsushima, Hiroaki Habaki, Junjiro Kawasaki Electrochemistry communications . 2000,第7期

机译：印刷线路板盲孔中的化学镀铜。轴向温度梯度均匀沉积铜
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5. Recycling of electronic waste: Printed wiring boards. [D] . Luyima, Alex. 2013

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6. Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boards Reviews. Copper Electroplating for Plated Through Hole of Printed Wiring Boards. [O] . Mitsuyasu CHIKUMA 1993

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7. Formulation of Molding Materials From Recycled Printed Wiring Boards [R] . Lula, J. W., Bohnert, G. W. 1998

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The Recycling of Printed Wiring Board Scraps Using a Shape Sorting Technique. Recovering Copper Components by the Inclined Vibrating Method.

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