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Mobility Enhancement in Amorphous In-Ga-Zn-O Thin-Film Transistor by Induced Metallic in Nanoparticles and Cu Electrodes

机译:纳米颗粒和Cu电极诱导金属诱导金属型金属薄膜晶体管的迁移率增强

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摘要

In this work, we fabricated a high-mobility amorphous indium-gallium-zinc-oxide (a-IGZO) thin-film transistor (TFT) based on alumina oxide (Al 2 O 3 ) passivation layer (PVL) and copper (Cu) source/drain electrodes (S/D). The mechanism of the high mobility for a-IGZO TFT was proposed and experimentally demonstrated. The conductivity of the channel layer was significantly improved due to the formation of metallic In nanoparticles on the back channel during Al 2 O 3 PVL sputtering. In addition, Ar atmosphere annealing induced the Schottky contact formation between the Cu S/D and the channel layer caused by Cu diffusion. In conjunction with high conductivity channel and Schottky contact, the a-IGZO TFT based on Cu S/D and Al 2 O 3 PVL exhibited remarkable mobility of 33.5–220.1 cm 2 /Vs when channel length varies from 60 to 560 μ m. This work presents a feasible way to implement high mobility and Cu electrodes in a-IGZO TFT, simultaneously.
机译:在这项工作中,我们制造了一种基于氧化铝(Al 2 O 3)钝化层(PVL)和铜(Cu)的高迁移率非晶铟 - 镓 - 氧化锌(A-IGZO)薄膜晶体管(TFT)源/漏电极(S / D)。提出并通过实验证明了对A-IGZO TFT的高迁移率的机制。由于在Al 2 O 3 PV1溅射期间,由于在后通道上形成金属纳米颗粒,沟道层的电导率显着提高。此外,AR气氛退火诱导Cu S / D与Cu扩散引起的沟道层之间的肖特基接触形成。结合高电导率通道和肖特基接触,基于Cu S / D和Al 2 O 3 PVL的A-IgZO TFT在通道长度从60至560μm变化时,显示出显着的迁移率为33.5-220.1cm 2 / vs。这项工作呈现了一种可行的方式,可以同时在A-IGZO TFT中实现高迁移率和Cu电极。

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