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DMAB Effects in Electroless Ni Plating for Flexible Printed Circuit Board

机译：用于柔性印刷电路板的化学镀NI电镀中的DMAB效果

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Hyung-Chul Kim; Sa-Kyun Rha; Youn-Seoung Lee;
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年度 2014
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1. Development of hybrid process for double-side flexible printed circuit boards using roll-to-roll gravure printing, via-hole printing, and electroless plating [J] . Park Janghoon, Lee Jongsu, Park Sungsik, The International Journal of Advanced Manufacturing Technology . 2016,第9a12期

机译：使用卷对卷凹版印刷，通孔印刷和化学镀技术开发双面柔性印刷电路板的混合工艺
2. Development of hybrid process for double-side flexible printed circuit boards using roll-to-roll gravure printing, via-hole printing, and electroless plating [J] . Park Janghoon, Lee Jongsu, Park Sungsik, The International Journal of Advanced Manufacturing Technology . 2016,第9a12期

机译：使用卷对卷凹版印刷，通孔印刷和化学镀技术开发双面柔性印刷电路板的混合工艺
3. Effects of Ultrasonic Process on the Electroless Cu Plating on Non-Conductive Printed Circuit Board Substrate [J] . Kang Ju-Suk, Chun Hong-Wook, Lee Jae-Ho Nanoscience and Nanotechnology Letters . 2018,第9期

机译：超声波处理对非导电印刷电路板基板的电镀Cu电镀的影响
4. The Electroless Ni-P Plating Film Adapting for Flexible Printed Wiring Boards [C] . Yasuhiro Tanabe, Yuriko Yamada, Kimiko Kudo Electronic Circuits World Convention . 2014

机译：用于柔性印刷线路板的化学镀镍电镀膜
5. Microstructure and mechanical properties of electroless copper and their influence on the reliability of printed-circuit boards. [D] . Lin, Kuanchih. 1990

机译：化学镀铜的微观结构和机械性能及其对印刷电路板可靠性的影响。
6. Rendering Wood Veneers Flexible and Electrically Conductive through Delignification and Electroless Ni Plating [O] . Minfeng Chen, Weijun Zhou, Jizhang Chen, 2019

机译：通过木质化和化学镀镍工艺使木质单板具有柔性和导电性
7. Effect of Ni Content in the Electroless Copper Plating Film on Recrystallization at the Bottom of via in Printed Circuit Board [O] . Hidekazu HONMA, Yuuhei KITAHARA, Joonhaeng KANG 2020

机译：Ni含量在电镀铜镀膜中对印刷电路板底部重结晶的影响

DMAB Effects in Electroless Ni Plating for Flexible Printed Circuit Board

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